Ling, X.Y.; Phang, I.Y.; Reinhoudt, D.N.; Vancso, G.J.; Huskens, J.
Supramolecular Layer-by-Layer Assembly of 3D Multicomponent Nanostructures via Multivalent Molecular Recognition. Int. J. Mol. Sci. 2008, 9, 486-497.
https://doi.org/10.3390/ijms9040486
AMA Style
Ling XY, Phang IY, Reinhoudt DN, Vancso GJ, Huskens J.
Supramolecular Layer-by-Layer Assembly of 3D Multicomponent Nanostructures via Multivalent Molecular Recognition. International Journal of Molecular Sciences. 2008; 9(4):486-497.
https://doi.org/10.3390/ijms9040486
Chicago/Turabian Style
Ling, Xing Yi, In Yee Phang, David N. Reinhoudt, G. Julius Vancso, and Jurriaan Huskens.
2008. "Supramolecular Layer-by-Layer Assembly of 3D Multicomponent Nanostructures via Multivalent Molecular Recognition" International Journal of Molecular Sciences 9, no. 4: 486-497.
https://doi.org/10.3390/ijms9040486
APA Style
Ling, X. Y., Phang, I. Y., Reinhoudt, D. N., Vancso, G. J., & Huskens, J.
(2008). Supramolecular Layer-by-Layer Assembly of 3D Multicomponent Nanostructures via Multivalent Molecular Recognition. International Journal of Molecular Sciences, 9(4), 486-497.
https://doi.org/10.3390/ijms9040486