Hera, D.; Berndt, A.; Günther, T.; Schmiel, S.; Harendt, C.; Zimmermann, A.
Flexible Packaging by Film-Assisted Molding for Microintegration of Inertia Sensors. Sensors 2017, 17, 1511.
https://doi.org/10.3390/s17071511
AMA Style
Hera D, Berndt A, Günther T, Schmiel S, Harendt C, Zimmermann A.
Flexible Packaging by Film-Assisted Molding for Microintegration of Inertia Sensors. Sensors. 2017; 17(7):1511.
https://doi.org/10.3390/s17071511
Chicago/Turabian Style
Hera, Daniel, Armin Berndt, Thomas Günther, Stephan Schmiel, Christine Harendt, and André Zimmermann.
2017. "Flexible Packaging by Film-Assisted Molding for Microintegration of Inertia Sensors" Sensors 17, no. 7: 1511.
https://doi.org/10.3390/s17071511
APA Style
Hera, D., Berndt, A., Günther, T., Schmiel, S., Harendt, C., & Zimmermann, A.
(2017). Flexible Packaging by Film-Assisted Molding for Microintegration of Inertia Sensors. Sensors, 17(7), 1511.
https://doi.org/10.3390/s17071511