1. Introduction
Wide dynamic range image sensors are required for many applications such as digital cameras, security systems, automobiles and industrial cameras. However, there exists a difficulty to meet all the requirements of high sensitivity, low noise, sufficient wide dynamic range, and small motion blur. Many methods to enhance the dynamic range of CMOS image sensors have been reported. The nonlinear responses such as the logarithmic response [
1] and well capacity adjustment [
2] are useful for dynamic range expansion with a relatively simple structure and processing. However, these techniques are not compatible with a pinned photodiode technology, which is a key technology for low noise image sensors. Another group of dynamic expansion methods uses multiple exposure-time signals in one frame [
3-
5] and the pinned photodiodes can be used. However, the use of multiple different exposure-time signals has the problem of the motion blur. A technique using an in-pixel overflow integration capacitor [
6,
7] has excellent properties from the viewpoints of low noise by using pinned photodiodes and small motion blur. However, in this method, the dynamic range is determined by the capacitor size in the pixel.
In this paper, wide dynamic range expansion techniques for the flexible control of dynamic range and reduced motion blur are proposed. The pixel contains two charge storages, a photodiode and a storage diode. The storage diode is connected to the photodiode via a separation gate, SP. To expand the dynamic range of the sensor, the SP gate for short period of time is repeatedly opened during accumulation period in the photodiode to allow charge generated on the photo-detector between SP gate and photodiode, flowing into the storage diode.
Since the charge in storage diode can also be controlled by the accumulation time in the storage diode, the dynamic range can be expanded by the combination of the SP gate control and short accumulation time in the storage diode. The signal charge for short accumulation time in the storage diode is read out for multiple times in one frame. On the other hand, the charge in the photodiode is accumulated for long time, maximally frame period to achieve high sensitivity. The read multiple short-accumulation time signals of the storage diode and the long-accumulation time signal of the photodiode are synthesized in an external system.
The proposed techniques enable the flexible control of the dynamic range for most of applications. Furthermore, the duration of the signal accumulation in the storage diode can be approximately equalized to that of the photodiode, and the problem of unnatural motion blur can be reduced. The operation of the sensitivity control with the separation gate is confirmed by device simulations. The function of the multiple short-time accumulations has been confirmed by implemented in a prototyped chip. In the following, the pixel structure, the dynamic range expansion methods, the enhancement of SP gate controllability and the implementation of a prototype sensor chip are described.
4. Enhancement of SP gate controllability
To enhance the SP gate controllability, or to increase the sensitivity ratio S
SD/S
SDC, the formation of a blocking layer under the SD which blocks the diffused photo-electrons from deep inside the pixel as shown in
Figure 6(a), is useful. Relatively highly doped p-layer, p-type well region, is formed under the SD region. The difference of doping concentration between p-type well and p-type substrate creates a potential barrier to electrons generated at deep inside, preventing the electrons from flowing into the SD region.
The effect of the blocking layer is confirmed by device simulations. In
Table 1, the size parameters used in the simulations are shown.
Figure 6 shows a simulation result to show the effectiveness of the blocking layer. It shows movement of a photo-electron diffused from deep inside the pixel to the surface in case of a pixel with [
Figure 6(a)] and without [
Figure 6(b)] the blocking layer formed under the SD, respectively. Using the blocking layer, the photo-electron diffused from deep inside the pixel reaches to the PD region, while it comes to the SD region if the blocking layer is not used.
Fig. 7 shows the sensitivity ratio, S
SDC/S
PD as a function of the wavelength of light for the pixel with and without the blocking layer under the SD. Without the blocking layer, the sensitivity ratio has a large dependency to the light wavelength. With the blocking layer, the sensitivity when the SP gate is closed has relatively low sensitivity and less dependent to the incident light wavelength.
The sensitivity control in the SD with the SP gate is simulated. In the simulation, the blocking layer under the SD is used.
Figure 8 shows the sensitivity ratio as a function of the wavelength of incident light when the SP gate is closed (S
SDC/S
PD) and opened (S
SD/S
PD). In the simulation, the SP gate open period, T
SP is set to full period in every cycle of the signal readout of one row, T
H, and the full frame period, T
F, is set to 33 ms. The simulation result shows the sensitivity ratio, S
SD/S
PD can be controlled efficiently by the SP gate. The sensitivity ratio S
SD/S
SDC given by
is calculated to be 5 to 14 depending on the incident light wavelength. For meeting the requirements of both the wide dynamic range and small motion blur, the controllability of the SD sensitivity with the SP gate is very important. Using the blocking layer, the controllability of the SD sensitivity with SP gate can be sufficiently increased.
5. Implementation for testing wide dynamic range imaging with multiple short accumulations
The proposed pixel structure requires additional process steps for the SP gate control of sensitivity. As a preliminary study to this final goal, a prototype CMOS image sensor using standard CMOS image sensor process is implemented. In the standard CMOS image sensor technology, the lightly doped n-type region in the PD and p-type region under the SD cannot be created. Therefore, in the prototype chip, the sensitivity control with the accumulation time and the number of the readout times only in the SD is tested.
The equivalent pixel structure is shown in
Figure 9. The light is mainly irradiated to the PD region, and the SD region receives leakage light flux only.
Figure 10 shows the chip micrograph of the prototype wide dynamic range CMOS image sensor with 0.18
μm technology. The pixel pitch is 7.5
μm. The aperture ratio is 17.5 % and a microlens is used at the top of the structure.
The sensor contains a vertical and horizontal shift registers, noise canceling column amplifiers and output buffers. The pixel array is connected to noise canceling column amplifiers where the reset noise and the fixed pattern noise are cancelled using correlated double sampling (CDS) technique. The analog sensor outputs are connected to a 12bits AD converter on a camera board for testing.
Control pulses for the chip are generated by an off-chip FPGA board, so that the accumulation and readout timing can be manipulated by an appropriate verilog HDL program.
Figure 11 shows the accumulation and readout timing of the actually implemented sensor. In the implemented pixel structure, the charge accumulation time in the PD is set to full frame period, T
F, which is 33 ms at 30 fps and the output is read out once per frame, while the charge accumulation time in the SD is set to shorter time, T
S, which is 100 μs per sub-frame. Therefore, the ratio of T
F to T
S is 330. The short accumulation in the SD and the readout are repeated multiple times per frame, e.g. four times in
Figure 11.
The linearity of the PD and SD outputs of the image sensor is measured as shown in
Figure 12. The light intensity is controlled by ND filters and an iris in a filter box. Measurement results show that the image sensor has a sufficient linear response. The linearity up to 22 lx and 15,000 lx is obtained in the PD and SD output signals, respectively. The SNR characteristic of the proposed image sensor is shown in
Figure 13. The minimum illumination level when the SNR equals to 0 dB is 0.03 lx and the maximum illumination level is 15,000 lx. The combined dynamic range with the PD and SD signals is 114 dB.
From
Figure 13, the SNR dip without multiple sampling is 38 dB. Using the sampling of four times in the SD signal, the SNR dip is reduced to 32 dB. Thus, the SNR dip is improved by 6 dB and it is explained by the calculation with
Eq. (9). The SNR dip depends on the choice of T
F/T
S, and if the application of the wide dynamic range sensor does not allow a large SNR dip, the ratio T
F/T
S has to be reduced and the resulting dynamic range is also reduced. By using the multiples sampling, the dynamic range can be increased compared with the single sampling case under the condition of the same SNR at the switching point. From
Eq. (9), the dynamic range enhancement using the multiple sampling of M times is a factor of M if the noise is dominated by photon shot noise. On the other hand, if the readout random noise dominates, the dynamic range enhancement factor using the M samplings is
.
Figure 14 shows the measured dynamic range enhancement factor to the T
F/T
S. In the measurement result of
Figure 14, the factor is 2.75 to 3.45, depending to the choice of T
F/T
S.