Liu, P.; Kong, X.; Du, C.; Wang, C.; Wang, D.; Oeser, M.
Numerical Investigation of the Temperature Field Effect on the Mechanical Responses of Conventional and Cool Pavements. Materials 2022, 15, 6813.
https://doi.org/10.3390/ma15196813
AMA Style
Liu P, Kong X, Du C, Wang C, Wang D, Oeser M.
Numerical Investigation of the Temperature Field Effect on the Mechanical Responses of Conventional and Cool Pavements. Materials. 2022; 15(19):6813.
https://doi.org/10.3390/ma15196813
Chicago/Turabian Style
Liu, Pengfei, Xiangrui Kong, Cong Du, Chaohe Wang, Di Wang, and Markus Oeser.
2022. "Numerical Investigation of the Temperature Field Effect on the Mechanical Responses of Conventional and Cool Pavements" Materials 15, no. 19: 6813.
https://doi.org/10.3390/ma15196813
APA Style
Liu, P., Kong, X., Du, C., Wang, C., Wang, D., & Oeser, M.
(2022). Numerical Investigation of the Temperature Field Effect on the Mechanical Responses of Conventional and Cool Pavements. Materials, 15(19), 6813.
https://doi.org/10.3390/ma15196813