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Ramli MII, Salleh MAAM, Abdullah MMAB, Zaimi NSM, Sandu AV, Vizureanu P, Rylski A, Amli SFM. Formation and Growth of Intermetallic Compounds in Lead-Free Solder Joints: A Review. Materials. 2022; 15(4):1451. https://doi.org/10.3390/ma15041451

Ramli, Mohd Izrul Izwan, Mohd Arif Anuar Mohd Salleh, Mohd Mustafa Al Bakri Abdullah, Nur Syahirah Mohamad Zaimi, Andrei Victor Sandu, Petrica Vizureanu, Adam Rylski, and Siti Farahnabilah Muhd Amli. 2022. "Formation and Growth of Intermetallic Compounds in Lead-Free Solder Joints: A Review" Materials 15, no. 4: 1451. https://doi.org/10.3390/ma15041451

Ramli, M. I. I., Salleh, M. A. A. M., Abdullah, M. M. A. B., Zaimi, N. S. M., Sandu, A. V., Vizureanu, P., Rylski, A., & Amli, S. F. M. (2022). Formation and Growth of Intermetallic Compounds in Lead-Free Solder Joints: A Review. Materials, 15(4), 1451. https://doi.org/10.3390/ma15041451