Woźnicki, A.; Leszczyńska-Madej, B.; Włoch, G.; Madura, J.; Bogusz, M.; Leśniak, D.
Homogenization of Extrusion Billets of a Novel Al-Mg-Si-Cu Alloy with Increased Copper Content. Materials 2023, 16, 2091.
https://doi.org/10.3390/ma16052091
AMA Style
Woźnicki A, Leszczyńska-Madej B, Włoch G, Madura J, Bogusz M, Leśniak D.
Homogenization of Extrusion Billets of a Novel Al-Mg-Si-Cu Alloy with Increased Copper Content. Materials. 2023; 16(5):2091.
https://doi.org/10.3390/ma16052091
Chicago/Turabian Style
Woźnicki, Antoni, Beata Leszczyńska-Madej, Grzegorz Włoch, Jacek Madura, Marek Bogusz, and Dariusz Leśniak.
2023. "Homogenization of Extrusion Billets of a Novel Al-Mg-Si-Cu Alloy with Increased Copper Content" Materials 16, no. 5: 2091.
https://doi.org/10.3390/ma16052091
APA Style
Woźnicki, A., Leszczyńska-Madej, B., Włoch, G., Madura, J., Bogusz, M., & Leśniak, D.
(2023). Homogenization of Extrusion Billets of a Novel Al-Mg-Si-Cu Alloy with Increased Copper Content. Materials, 16(5), 2091.
https://doi.org/10.3390/ma16052091