Zhan, D.; Lin, J.; Yang, X.; Huang, R.; Yi, K.; Liu, M.; Zheng, H.; Xiong, J.; Cai, N.; Wang, H.;
et al. A Lightweight Method for Detecting IC Wire Bonding Defects in X-ray Images. Micromachines 2023, 14, 1119.
https://doi.org/10.3390/mi14061119
AMA Style
Zhan D, Lin J, Yang X, Huang R, Yi K, Liu M, Zheng H, Xiong J, Cai N, Wang H,
et al. A Lightweight Method for Detecting IC Wire Bonding Defects in X-ray Images. Micromachines. 2023; 14(6):1119.
https://doi.org/10.3390/mi14061119
Chicago/Turabian Style
Zhan, Daohua, Jian Lin, Xiuding Yang, Renbin Huang, Kunran Yi, Maoling Liu, Hehui Zheng, Jingang Xiong, Nian Cai, Han Wang,
and et al. 2023. "A Lightweight Method for Detecting IC Wire Bonding Defects in X-ray Images" Micromachines 14, no. 6: 1119.
https://doi.org/10.3390/mi14061119
APA Style
Zhan, D., Lin, J., Yang, X., Huang, R., Yi, K., Liu, M., Zheng, H., Xiong, J., Cai, N., Wang, H., & Qiu, B.
(2023). A Lightweight Method for Detecting IC Wire Bonding Defects in X-ray Images. Micromachines, 14(6), 1119.
https://doi.org/10.3390/mi14061119
