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Journal: Micromachines, 2023
Volume: 14
Number: 1119
1119
Article: A Lightweight Method for Detecting IC Wire Bonding Defects in X-ray Images
Authors: by Daohua Zhan, Jian Lin, Xiuding Yang, Renbin Huang, Kunran Yi, Maoling Liu, Hehui Zheng, Jingang Xiong, Nian Cai, Han Wang and Baojun Qiu
Link: https://www.mdpi.com/2072-666X/14/6/1119

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