Design and Algorithm Integration of High-Precision Adaptive Underwater Detection System Based on MEMS Vector Hydrophone
Abstract
:1. Introduction
2. Principles and Methods
2.1. Design of MEMS Detection System
2.2. Sensing Principle of MEMS Vector-Sensitive Probe
- (a)
- The wafer is subjected to acid and alkaline cleaning to remove surface organic matter, particulate contaminants, and metal impurities. Subsequently, it is rinsed multiple times with deionized water and dried with nitrogen to meet the cleanliness requirements for thermal oxidation and deposition processes on the wafer.
- (b)
- Plasma-enhanced chemical vapor deposition (PECVD) is used to form a 20 nm thick oxide layer on the wafer surface, aiming to reduce lattice damage and achieve electrical isolation of the metal.
- (c)
- The first photolithography is performed on the front side to inject B ions into the pressure resistance region, with an injection dose of 4.0 × 1014 cm2 and an injection energy of 80 keV. Subsequently, high-temperature annealing is conducted in a nitrogen environment at 1050 °C for 120 min.
- (d)
- The second photolithography is carried out on the front side to inject B ions into the heavily doped region, with an injection dose of 3 × 1015 cm2 and an injection energy of 110 keV. Then, annealing is performed at 1000 °C for 30 min.
- (e)
- The third photolithography on the front side utilizes reactive ion etching (RIE) to etch the oxide layer, exposing the heavily doped silicon region and the center positioning hole.
- (f)
- The fourth photolithography on the front side involves depositing aluminum metal on the surface using sputtering technology. Subsequently, metal patterning is achieved using a lift-off process. Then, alloy annealing is conducted at 200 °C to form ohmic contact between the metal and the heavily doped region. At this point, the pressure resistance structure is formed.
- (g)
- The fifth photolithography on the front side employs RIE technology to etch the deposited silicon oxide and device layer silicon, forming the four-beam-central block area.
- (h)
- The sixth photolithography on the back side employs deep reactive ion etching (DRIE) technology to etch the back chamber. Then, the buried oxide layer is etched using HF buffer solution (BOE) to release the four-beam-central block structure.
2.3. LMS Adaptive Signal Processing Method and Improvements
2.4. DOA Estimation and Simulation
3. Experiment
3.1. Indoor Experiment
3.2. Field Experiment
4. Conclusions
Author Contributions
Funding
Data Availability Statement
Acknowledgments
Conflicts of Interest
References
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Designer | Concavity Depth (dB) | Vector Channel Sensitivity (dB) | Gain Magnitude (dB) |
---|---|---|---|
Zhu et al. (2021 [2]) | 30 | −182.7 dB@1 kHz (0 dB~1 V/µPa) | 49.5 |
Geng et al. (2023 [18]) | 40 | −180.9 dB@1 kHz (0 dB~1 V/µPa) | 49.5 |
This Paper | 40 | −175.4 dB@1 kHz (0 dB~1 V/µPa) | 54.0 |
SNR/dB | AVG/° | CI/° | Sigma | CI |
---|---|---|---|---|
−10 | 59.2259 | [57.2809 61.1611] | 9.7572 | [8.5630 11.3295] |
−5 | 60.0736 | [59.5117 60.6351] | 2.8307 | [2.4854 3.7884] |
0 | 59.9980 | [59.8002 60.1958] | 0.9968 | [0.8752 1.1580] |
5 | 60.0667 | [59.9689 60.1644] | 0.4925 | [0.4324 0.5721] |
10 | 59.9851 | [59.9356 60.0346] | 0.2494 | [0.2190 0.2897] |
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Liu, Y.; Jing, B.; Zhang, G.; Pei, J.; Jia, L.; Geng, Y.; Bai, Z.; Zhang, J.; Guo, Z.; Wang, J.; et al. Design and Algorithm Integration of High-Precision Adaptive Underwater Detection System Based on MEMS Vector Hydrophone. Micromachines 2024, 15, 514. https://doi.org/10.3390/mi15040514
Liu Y, Jing B, Zhang G, Pei J, Jia L, Geng Y, Bai Z, Zhang J, Guo Z, Wang J, et al. Design and Algorithm Integration of High-Precision Adaptive Underwater Detection System Based on MEMS Vector Hydrophone. Micromachines. 2024; 15(4):514. https://doi.org/10.3390/mi15040514
Chicago/Turabian StyleLiu, Yan, Boyuan Jing, Guojun Zhang, Jiayu Pei, Li Jia, Yanan Geng, Zhengyu Bai, Jie Zhang, Zimeng Guo, Jiangjiang Wang, and et al. 2024. "Design and Algorithm Integration of High-Precision Adaptive Underwater Detection System Based on MEMS Vector Hydrophone" Micromachines 15, no. 4: 514. https://doi.org/10.3390/mi15040514
APA StyleLiu, Y., Jing, B., Zhang, G., Pei, J., Jia, L., Geng, Y., Bai, Z., Zhang, J., Guo, Z., Wang, J., Huang, Y., Xu, L., Liu, G., & Zhang, W. (2024). Design and Algorithm Integration of High-Precision Adaptive Underwater Detection System Based on MEMS Vector Hydrophone. Micromachines, 15(4), 514. https://doi.org/10.3390/mi15040514