1. Introduction
Power electronics applications have been dominated for decades by silicon technology including Silicon Metal Oxide Semiconductor Field-Effect Transistors (MOSFETs) and insulated gate bipolar transistors (IGBTs). Utilizing them in various applications from low frequency to high frequency circuits required also developing capable fast gate drivers [
1]. Because MOSFETs are unipolar devices, they are capable of fast switching, since phenomena like tail currents (due to stored charge from minority carriers) do not exist [
2]. Hence, the switching rates are determined primarily by the charging and discharging of parasitic capacitances; therefore, an optimal MOSFET design that reduces these capacitances can enable high frequency applications [
3]. At low voltage applications, such as automotive systems at 12 V, MOSFETs are featured by low on-state resistance, hence, low conduction losses. However, as the voltage level increases, the conduction losses increase due to higher on-state resistance resulting from thicker epitaxial voltage blocking layers. By introducing wide bandgap (WBG) devices like Silicon Carbide and Gallium Nitride (GaN) devices, the on-state resistance and switching speeds have achieved significant improvement for a wider spectrum of applications. Active gate driving [
4] with the aid of intelligent control of switching transients can limit the current and voltage commutation rate and overshoots, which therefore increases efficiency [
5] and mitigates Electromagnetic Interference (EMI) generation from current–voltage ringing [
6] and thermal cycles [
7].
Compared with Silicon (Si) MOSFETs, Silicon Carbide (SiC) MOSFETs have a lower gate charge, therefore enabling low power gate drivers for rapid switching. The challenge of driving low-side MOSFETs is simpler compared with high-side ones. Bootstrapped capacitor gate drivers are usually used, however, to achieve isolation between the drive signal circuit loop and the power current loop, and an isolated auxiliary power supply is needed [
8]. This brings cost, size and component numbers to the driver design.
Junction Field-Effect Transistor (JFET) devices are designed to handle large power levels, which necessitates careful consideration of the gate voltage levels and gate current capabilities. Inadequate gate voltage or insufficient gate current can result in improper JFET operation, leading to suboptimal performance or even device failure. MOSFETs, JFETs or IGBTs operate in harsh environments with high voltage transients and noise. Therefore, proper isolation techniques, such as optocouplers or gate drive transformers, are crucial to prevent unwanted coupling of noise or transients into the gate driver circuitry, which could negatively impact JFET performance or compromise its reliability.
In the realm of power electronics, isolated gate drivers play a pivotal role in enhancing the operational integrity and efficiency of systems employing MOSFETs or IGBTs. These drivers ensure proper gate control while isolating the control circuitry from high-power sections, thereby safeguarding against voltage spikes and facilitating precise control.
Figure 1 illustrates different isolated gate driver configurations. Optical isolation (
Figure 1a), i.e., TLP250, and capacitive isolation (
Figure 1b), i.e., UCC21520, require secondary isolated power supplies. They offer fast response times and robustness against Electromagnetic Interference, making it suitable for both pulsed PWM-operated circuits and non-pulsed circuits like solid-state switches. Inductive isolation (
Figure 1c) utilizes inductive coupling to transfer pulses across a magnetic barrier, accommodating a broad range of frequencies primarily for pulsed circuits.
Figure 1d,e present innovative drivers that eliminate the need for a secondary isolated power supply. The Si8751 (
Figure 1d) employs RF carrier techniques, while the TPSI3050 (
Figure 1e) integrates a transformer within the chip, simplifying the design and integration process. These advanced drivers offer a balance between speed, isolation effectiveness and complexity, making them suitable for various specific applications.
Optically isolated Photovoltaic Drivers (PVD) provide some advantages over other isolated driver circuits. They are well suited for applications where the MOSFET requires isolation, and are therefore suitable for low- and high-side driving. They have small footprints and can be connected in series and parallel. Unlike capacitive or transformer isolation which requires continuous AC pulsating feed to sustain the on or off state [
9], in particular, for applications with long on or off durations, the PVD can achieve this by using a small DC current sufficient to drive its Light Emitting Diode (LED). They also are able to drive MOSFETs in their linear region for current-limiting purposes or amplification. Recently, PVDs have gained popularity in isolating power from signal circuits without a need for extra power rails to achieve signalling and protection triggering [
10,
11]. They are able to produce sufficient voltage for the secondary side when their LEDs are biased at the primary side, which is shown in
Figure 2. They are a compact candidate for driving MOSFETs and IGBTs. Despite the potential of PVDs, comprehensive experimental studies evaluating their performance under different load conditions are scarce. This study bridges this gap by providing a detailed characterization of PVDs, emphasizing their suitability for high-voltage, low-bandwidth measurements and solid-state switching applications. Our work offers novel insights into the practical deployment of PVDs, contributing significantly to the existing body of knowledge. This paper experimentally investigates the capability of PVDs in driving Si MOSFETs, Si IGBTs and SiC MOSFETs (CoolSiC) in addition to their suitability for sensing circuits. Furthermore, a proposed simple design is proposed for JFET driving. The aim of the work is multifold and can be articulated as follows:
- (1)
Experimentally characterizing one off-the-shelf PVD by obtaining the IV curves and testing it under resistive and capacitive loadings.
- (2)
Conducting a small signal and large signal frequency excitation to identify its frequency response and its limitation in driving or signalling.
- (3)
Testing the PVD driving capability for different resistive and capacitive loads with different multiple series and parallel PVD configurations.
- (4)
Performing a double pulse test (DPT) for different power switches driven by multiple PVDs to assess the switching losses.
Figure 2.
The structure of the VOM1271 Photovoltaic Driver (PVD) showing the primary side with the LED and the secondary photovoltaic output.
Figure 2.
The structure of the VOM1271 Photovoltaic Driver (PVD) showing the primary side with the LED and the secondary photovoltaic output.
2. Methodology
This section aims to present the methodology adopted in this work to characterize the PVD and to investigate its applications in signalling and switching applications. There are few commercially available PVDs.
Table 1 lists some selected PVDs which have a range of short circuit currents and open-circuit voltages. The list is arranged from low to high short circuit currents. The output voltage could be as low as 8.2 V, suitable for driving some power switches with a low threshold voltage, and could be as high as 18 V, which suits the power switches which need to achieve lower on-state resistance. The switching speed varies, and no common conditions are available. As observed from the table, the VOM1271 sits in the mid-range of PVD capabilities. The VOM1271 provides an optimal trade-off between performance parameters such as switching speed and internal turn-off circuitry, which are critical for both switching and signal processing applications. Specifically, the VOM1271 features an integrated fast turn-off circuit, which simplifies the external circuitry required for rapid switching applications. Therefore, in this study, we have chosen VOM1271 from Vishay [
12] as the device under test for characterization. The experimental setup for characterizing the PVD involved a series of tests under controlled conditions. The testing procedures included:
IV Characterization: Measuring the current–voltage (IV) characteristics under different illumination levels.
Frequency Response Tests: Conducting small signal frequency response (SSFR) and large signal frequency response (LSFR) tests to evaluate the PVD’s bandwidth.
Load Tests: Testing the PVD performance under varying resistive and capacitive loads to simulate real-world application conditions.
2.1. PVD IV Characterization
PVD VOM1271 is a photovoltaic embedded inside the chip package and can be illuminated using an embedded LED. The LED is considered as the primary side, while the photovoltaic output is the secondary side. It is able to generate a voltage and current at the secondary terminals, respecting some factors like the primary LED current and secondary side loading. The PVD is provided with an integrated fast turn-off internal circuit to achieve a fast zero voltage across the secondary terminals, promoting it as a strong candidate as a driver for power switches as no external turn-off circuity is required. This feature, combined with a Small Outline Package (SOP4) package, provides designers with a small footprint, making it a highly integrated isolated gate driver solution for a large variety of MOSFET/IGBT driver applications. The design of the integrated fast turn-off internal circuit was not disclosed by the manufacturer. The maximum rated withstanding isolation voltage is 3750
, according to UL1577 for the 1 min test, and 707
Vpeak as the repetitive peak isolation voltage, according to DIN EN 60747-5-5 [
13].
The main parameters used to describe the output of a photovoltaic are the open-circuit voltage (
, short circuit current
and maximum output power
. These parameters are determined by tracing the output VI values under different illumination and loading conditions, as shown in
Figure 3a. A typical IV curve of a PV cell is shown in
Figure 3b, which also is expected from the PVD. The illumination is performed by the internal LED, which should be supplied by a sufficient current.
The datasheet highlights 50 mA as a maximum for the forward LED current . Therefore, the 30 mA and 40 mA testing currents are selected for IV characterization.
2.2. Frequency Response
The prospective PVD is to be used in two ways: either as a switching device for, i.e., power switches like MOSFETs, or using it for a signal transfer and measurement, i.e., voltage measurement. Due to the nonlinear nature of the PVD, two methods for frequency response investigations have been proposed: namely, the small signal frequency response (SSFR) and the large signal frequency response (LSFR).
The point of the SSFR is to push the PVD into its linear region, which is done by biasing the PVD LED by
and injecting a small sine wave signal
, as shown in
Figure 4, to modulate
considering the frequency range from 20 Hz to 1 MHz with
. The PVD LED will be biased by a DC source of
5.4 V via a resistor of
120 ohms. That will modulate
between 30 and 40 mA. The output frequency response should indicate the frequency range that this PVD would accept in its linear region. The point of the LSFR is to push the PVD to cutoff, and this is done by biasing its PVD LED by
2.5 V and injecting a large sine wave signal of
. The 2.5 V offset here is important to prevent the PVD LED from having a reverse voltage, which is limited to a maximum of 5 V [
12].
2.3. Capacitive Loading
MOSFETs and IGBTs are featured by their gate capacitances which require charging currents for turn-on and discharging currents for turn-off. Similarly, signal processing circuits like operational amplifiers potentially connected at the PVD output have different but a smaller range of input capacitances.
Figure 5 aims to investigate the time response (rise time and fall time) of the PVD output when it is loaded by different values of capacitors (
). It is worth mentioning that
are considerably small values to emulate the power of MOSFET input capacitances; however, this study would provide a comprehensive study for switching and signalling applications. The VOM1271 model in
Figure 5 included the embedded turn-off circuit.
The capacitor behaves as a short circuit at the beginning of the charging cycle, therefore absorbing high currents, leading the PVD to operate in the constant current region when it supplies
. As shown in
Figure 5b, constant current will be supplied during the transient state and ends at steady state where a constant voltage is supplied. The transient time can be calculated by:
where
and
are the PVD output capacitance and load capacitance, respectively.
2.4. Resistive Loading
When the PVD is loaded by a resistor, that resistor defines an operating point on the IV curve, defining a specific voltage and current value at steady state, as shown in
Figure 5b. The selection of a resistor value might push the PVD to work in the constant current region or constant voltage region. Low resistive loads draw higher current, leading the PVD to work in the constant current region; the steady-state load voltage will follow:
Usually, for a MOSFET driving application, a parallel gate-to-source resistor is used to accelerate the turn-off process [
14]. This impacts the operating point of the PVD. The use of parallel gate-to-source resistors may not be necessary due to the integrated fast turn-off circuit within the VOM1271 PVD, which effectively manages the turn-off transition.
2.5. Multiple Cells
Some applications require more voltage or current output from the PVD to suit their operation. Therefore, a set of PVD configurations are proposed here for testing while capacitive loading only is considered. The configurations under investigation include single, two and three PVDs in series and similarly in parallel, as shown in
Figure 6. The capacitive load is chosen as 1000 pF and 500 Hz as the switching frequency. The experimental testing board is shown in
Figure 7, and it is worth mentioning that the temperature is at the room temperature of 25 °C.
2.6. Signalling Application—High Voltage Measurement
The PVD output current
is linearly proportional to the PVD’s LED driving current
. An analogue signal transfer with isolation would be possible by biasing the PVD to operate in its linear region and superimposing the driving current with a signal waveform similar to the SSFR test. Due to its high voltage isolation capability, the PVD is able to provide high voltage measurement. DC and AC voltage measurements are possible based on the biasing point. In this test, the PVD will be set to measure a high AC mains voltage (230 Vrms) at its primary side and transfer an attenuated version to the secondary side. The PVD LED is biased by a 25 mA current source, as shown in
Figure 8.
and
are selected to be 1M and 10k ohm, respectively. LTSpice has been used to duplicate the test using the model provided by VISHAY [
15].
2.7. Switching Application—Double Pulse Testing
Clamped DPT is used to assess the switching losses of a power switch at a specific current value under a specific voltage stress. Also, it is used to assess the capability of a gate driver to achieve full and fast switching, able to cut off and saturate the power switch. It will have the same testing condition of LSFR but with only a double pulse. A typical setup of the Clamped DPT is shown in
Figure 9, with an inductance of 2 mH. The freewheeling diode was a STPSC1206 Schottky Silicon Carbide diode, with a supply voltage (
) of 60 V. Micsig differential voltage and current probes were used with a 100 MHz bandwidth with SIGLENT 100 MHz oscilloscope. The MOSFET gate voltage,
, is the PVD output signal. In this paper, the DPT is used to investigate the ability of the PVD in driving a Si SJ MOSFET, a Si Trench IGBT and a SiC Trench MOSFET.
Table 2 shows the three samples under test. The power devices have been selected to have the same packaging, close breakdown voltages and similar on-state resistances and threshold voltages. A single and three PVDs are configured in series and parallel in this test.
4. Conclusions
This paper focuses on the characterization of a selected PVD, VOM1271. The steady-state operating point of the PVD output is determined by the value of the resistive load, while capacitive loading shifts the operating point from short circuit to open voltage regions. The bandwidth of the PVD is defined based on the application to be 20 kHz for small signal processing and 2.5 kHz for switching. When using a resistive load greater than 330 kΩ, the PVD operates in a constant current region and delivers higher voltage to the load. Conversely, a capacitive load of around 1000 pF or higher causes a delay in the turn-on operation.
The PVD is a cost-effective option for isolated high voltage sensors when a low power, isolated power supply provides the biasing current on the primary side. Its low frequency driving capability is suitable for applications like Anti-lock Braking System (ABS) solenoid drivers and in-line rectification circuits with low repetitive switching. There is potential for innovation in developing fully isolated self-powered sensors. The PVD also offers a fast turn-off, making it an optimal compact solution for solid-state protection devices such as circuit breakers. However, its slow turn-on characteristics can present challenges and result in high losses for hard switch power devices. On the other hand, the PVD provides a simple and affordable solution for driving JFETs, reducing complexity and eliminating the need for an additional negative power source, although it may pose challenges for applications that require a fast turn-off.