Kalaš, D.; Soukup, R.; Řeboun, J.; Radouchová, M.; Rous, P.; Hamáček, A.
Novel SMD Component and Module Interconnection and Encapsulation Technique for Textile Substrates Using 3D Printed Polymer Materials. Polymers 2023, 15, 2526.
https://doi.org/10.3390/polym15112526
AMA Style
Kalaš D, Soukup R, Řeboun J, Radouchová M, Rous P, Hamáček A.
Novel SMD Component and Module Interconnection and Encapsulation Technique for Textile Substrates Using 3D Printed Polymer Materials. Polymers. 2023; 15(11):2526.
https://doi.org/10.3390/polym15112526
Chicago/Turabian Style
Kalaš, David, Radek Soukup, Jan Řeboun, Michaela Radouchová, Pavel Rous, and Aleš Hamáček.
2023. "Novel SMD Component and Module Interconnection and Encapsulation Technique for Textile Substrates Using 3D Printed Polymer Materials" Polymers 15, no. 11: 2526.
https://doi.org/10.3390/polym15112526
APA Style
Kalaš, D., Soukup, R., Řeboun, J., Radouchová, M., Rous, P., & Hamáček, A.
(2023). Novel SMD Component and Module Interconnection and Encapsulation Technique for Textile Substrates Using 3D Printed Polymer Materials. Polymers, 15(11), 2526.
https://doi.org/10.3390/polym15112526