Liu, B.; Wu, M.; Du, W.; Jiang, L.; Li, H.; Wang, L.; Li, J.; Zuo, D.; Ding, Q.
The Application of Self-Healing Microcapsule Technology in the Field of Cement-Based Materials: A Review and Prospect. Polymers 2023, 15, 2718.
https://doi.org/10.3390/polym15122718
AMA Style
Liu B, Wu M, Du W, Jiang L, Li H, Wang L, Li J, Zuo D, Ding Q.
The Application of Self-Healing Microcapsule Technology in the Field of Cement-Based Materials: A Review and Prospect. Polymers. 2023; 15(12):2718.
https://doi.org/10.3390/polym15122718
Chicago/Turabian Style
Liu, Bo, Mingli Wu, Wei Du, Lu Jiang, Hongjun Li, Luoxin Wang, Jinhui Li, Danying Zuo, and Qingjun Ding.
2023. "The Application of Self-Healing Microcapsule Technology in the Field of Cement-Based Materials: A Review and Prospect" Polymers 15, no. 12: 2718.
https://doi.org/10.3390/polym15122718
APA Style
Liu, B., Wu, M., Du, W., Jiang, L., Li, H., Wang, L., Li, J., Zuo, D., & Ding, Q.
(2023). The Application of Self-Healing Microcapsule Technology in the Field of Cement-Based Materials: A Review and Prospect. Polymers, 15(12), 2718.
https://doi.org/10.3390/polym15122718