He, L.; Li, J.; Wu, X.; Mu, F.; Wang, Y.; Lu, Y.; Suga, T.
Robust Ag-Cu Sintering Bonding at 160 °C via Combining Ag2O Microparticle Paste and Pt-Catalyzed Formic Acid Vapor. Metals 2020, 10, 315.
https://doi.org/10.3390/met10030315
AMA Style
He L, Li J, Wu X, Mu F, Wang Y, Lu Y, Suga T.
Robust Ag-Cu Sintering Bonding at 160 °C via Combining Ag2O Microparticle Paste and Pt-Catalyzed Formic Acid Vapor. Metals. 2020; 10(3):315.
https://doi.org/10.3390/met10030315
Chicago/Turabian Style
He, Liangliang, Junlong Li, Xin Wu, Fengwen Mu, Yinghui Wang, Yangting Lu, and Tadatomo Suga.
2020. "Robust Ag-Cu Sintering Bonding at 160 °C via Combining Ag2O Microparticle Paste and Pt-Catalyzed Formic Acid Vapor" Metals 10, no. 3: 315.
https://doi.org/10.3390/met10030315
APA Style
He, L., Li, J., Wu, X., Mu, F., Wang, Y., Lu, Y., & Suga, T.
(2020). Robust Ag-Cu Sintering Bonding at 160 °C via Combining Ag2O Microparticle Paste and Pt-Catalyzed Formic Acid Vapor. Metals, 10(3), 315.
https://doi.org/10.3390/met10030315