Liu, S.; Zhi, Y.; Song, H.; Li, H.; Wang, W.; Hu, X.; Zhang, D.
Investigating the Thermal Conductance of the Cu/Si Interface Using the Molecular Dynamics Method. Metals 2024, 14, 453.
https://doi.org/10.3390/met14040453
AMA Style
Liu S, Zhi Y, Song H, Li H, Wang W, Hu X, Zhang D.
Investigating the Thermal Conductance of the Cu/Si Interface Using the Molecular Dynamics Method. Metals. 2024; 14(4):453.
https://doi.org/10.3390/met14040453
Chicago/Turabian Style
Liu, Shuai, Yueyi Zhi, Hongquan Song, Huijin Li, Weiping Wang, Xiaoyan Hu, and Dongbo Zhang.
2024. "Investigating the Thermal Conductance of the Cu/Si Interface Using the Molecular Dynamics Method" Metals 14, no. 4: 453.
https://doi.org/10.3390/met14040453
APA Style
Liu, S., Zhi, Y., Song, H., Li, H., Wang, W., Hu, X., & Zhang, D.
(2024). Investigating the Thermal Conductance of the Cu/Si Interface Using the Molecular Dynamics Method. Metals, 14(4), 453.
https://doi.org/10.3390/met14040453