Earlier studies suggest that achieving laser irradiance on the target in TOF mass spectrometry at the order of 1 GW/cm
2 is necessary to generate a plasma plume with minimal elemental fractionation, reflecting the surface’s true composition [
15]. To attain such high irradiance states from dense solids, lasers equipped with short-pulse passive Q-switching systems are required, offering advantages in coupling with the time-of-flight mass analyzer [
16]. Given the stringent mass and power budget constraints in deep space exploration missions, the microchip laser adopts a design strategy utilizing semiconductor laser-pumped passive Q-switching. In contrast to conventional lasers, the microchip laser’s resonant cavity is notably short, resulting in a brief photon lifetime and facilitating the generation of short pulses lasting on the order of nanoseconds or sub-nanoseconds. Passive Q-switching eliminates the need for electronic switching devices, reducing the system’s size and complexity while enhancing power efficiency. The repetition frequency can surpass a kilohertz, and the single-pulse energy can reach tens of microjoules. In addition, such systems provide excellent pulse to pulse energy stability, which is of high importance for laser ablation techniques. This approach addresses the unique challenges posed by deep space exploration missions, ensuring efficient and precise performance of the LA-TOF-MS under the constraints of limited mass and power resources.
The operating principle of the microchip laser, designed for application in deep space exploration TOF mass spectrometers, revolves around employing a short-cavity resonant structure with a saturable absorber to regulate laser generation. Initially, the saturable absorber exhibits a high absorption coefficient, which gradually decreases as the optical intensity rises. Upon reaching the saturation intensity, the saturable absorber swiftly transitions to a transparent state, facilitating the generation of a robust pulsed laser output [
17]. Contrasted with continuous pumping, pulsed pumping notably mitigates thermal effects on the crystal, resulting in improved pulse output energy, beam quality, and pulse stability. This paper aims to offer an introduction to the microchip laser, encompassing both structural and electronic design perspectives.
2.1. Structural Design of Microchip Laser
Illustrated in
Figure 1, a semiconductor laser diode (LD) serves as the initial energy source. The energy is coupled to the laser crystal through a lens assembly, functioning as an imaging optical system. The laser crystal comprises a solid gain medium and a saturable absorber, wherein the saturable absorber passively adjusts the quality factor (Q) to emit laser pulses with a narrow bandwidth and high energy. Typically, when the Q value is high, cavity loss is low. Thus, during the pumping phase, electrons transfer to the upper energy level. At this juncture, due to the characteristics of the saturable absorber, the Q value inside the cavity is low, resulting in high losses, preventing laser formation and retaining the electrons in the upper energy level. Once a sufficient number of electrons accumulate in the upper energy level, the Q value experiences a rapid increase. Subsequently, the electrons undergo a swift transition to the lower energy level, resulting in an instantaneous high-power laser output. This operational principle highlights the role of the saturable absorber in passive Q adjustment and the dynamic electron transitions that lead to precise and controlled pulsed laser emissions in deep space exploration TOF mass spectrometers.
Considering the imperative for small size, low power consumption, and a compact structure, the chosen pumping source is a semiconductor laser with a maximum power of 10 W and a wavelength of 808 nm. It possesses a threshold current of 1.8 A and operates at a voltage below 2.2 V. The advantageous low current emission requirement facilitates the development of a low-power drive system. To ensure optimal conversion efficiency, end-pumping is implemented, aligning the pump light co-linearly with the resonant cavity. Significant overlap between the pumped volume and the TEM
00 mode enhances efficient energy transfer. Utilizing an imaging optical system, the pump light is collimated and focused, effectively suppressing optical distortions. The distribution of pump light aligns with the volume of the resonant cavity mode, ensuring precise incidence within the laser crystal, as depicted in
Figure 2. This meticulous design approach contributes to the microchip laser’s efficiency, addressing the specific demands of deep space exploration missions for a compact, low-power laser system with optimal performance.
The conventional approach to preparing laser crystals involves various methods, such as bonding Nd
3⁺:YAG gain media to saturable absorbing crystals, including Cr⁴⁺:YAG [
18]. Alternatively, one material can be grown on the other to form a composite crystal [
19], or a saturable absorbing material can be coated onto the gain medium [
20]. The composite structure comprising Nd
3⁺:YAG and Cr
4⁺:YAG is characterized by its simplicity, good thermal stability, and extended service life, rendering it a high-quality passive Q-switched laser crystal [
21]. To leverage the absorption characteristics of Cr
4⁺:YAG at 1 μm, meticulous polishing of two planes perpendicular to the optical axis is necessary during production. The pumping-side surface requires coating with a dielectric material to facilitate pump light transmission and exhibit high reflectivity at the oscillation wavelength, ensuring the efficient absorption of pump light and the effective operation of the laser crystal at the desired wavelength. This methodical preparation enhances the performance and reliability of the laser crystal, making it a valuable component for passive Q-switching in laser systems.
Leveraging the operational characteristics of the semiconductor laser and laser crystal, a meticulously designed microchip laser structure that meets the specified requirements has been crafted, as shown in
Figure 3. The pumping source and laser crystal find their place on a baseplate crafted from oxygen-free copper, serving for collimation and alignment while facilitating rapid temperature conduction. At the central part of the baseplate, a cavity is hollowed to accommodate a lens assembly. This non-heating component minimizes contact with the baseplate, reducing the system’s heat dissipation area and consequently lowering heat dissipation power consumption. The laser crystal is securely pressed onto the baseplate through two L-shaped structures, enveloped by indium foils to ensure efficient heat conduction. Small holes are incorporated into the baseplate to house negative temperature coefficient thermistors, enabling real-time monitoring of the microchip laser’s operating temperature. Additionally, a groove is integrated into the bottom of the laser housing to accommodate a semiconductor cooler, allowing temperature control of the entire working environment and ensuring the stable operation of the microchip laser. A protective window is designed at the laser’s emission port, using a flat mirror to isolate dust and moisture from the surroundings. This comprehensive design approach addresses thermal management challenges, ensuring the microchip laser’s reliable and efficient performance in deep space exploration environments.
As indicated in existing literature, an increase in spot size, under the same laser power density, results in a heightened spatial charge of the resulting ion beam. Considering the limited drift length in subsequent mass analyzers, this could compromise ion focusing, leading to a notable decrease in mass resolution [
22]. To ensure precise excitation of the test substance, yielding singly charged ions for subsequent TOF mass spectrometry testing [
23], configuring a power adjustment device becomes imperative. This device facilitates simple adjustment of the output power during testing. Consequently, to attain micro-focus laser output and streamline the adjustment of the laser’s output power, an optical focusing system has been meticulously designed for the laser in this study. Illustrated in
Figure 4, the optical focusing system incorporates a removable optical sleeve, providing adaptability for different application needs. The system employs optical lenses with varying refractive indices to expand and contract, aiding in minimizing the spot size, increasing the focal length, and achieving micro-focus output. A λ/2 waveplate and a polarizing beamsplitter (PBS) collaborate to form a variable power attenuator, enabling power adjustment within the 5% to 95% range. Tuning the waveplate allows for precise adjustment of the laser intensity output. Concurrently, a portion of the signal light can be redirected for synchronous detection. This integrated optical focusing system enhances the precision and versatility of the microchip laser for optimal performance in diverse testing environments.
2.2. Design of Drive and Control System
Due to the strict constraints on available space and power in deep space exploration missions, all electronic systems in microchip lasers suitable for planetary mass spectrometry measurements must be customized. The laser operates based on the principle of current injection, inducing particle inversion in the active region. The recombination of electrons in the conduction band and holes in the valence band in semiconductor materials results in stimulated emission, converting electrical energy into optical energy excitation [
24]. Therefore, beyond the impact of the structure itself, the stability of the output from the electronic driving system is crucial for the laser’s performance. The stability and ripple of the driving current for the semiconductor laser used as a pumping source can alter the optical power, central wavelength, and spectral linewidth of the emitted pump light. For an ideal pump laser, the linewidth should be narrow, the central wavelength stable, and it should have an appropriate photon intensity. This necessitates high stability of the driving current and minimal ripple. Additionally, lasers are highly sensitive to temperature variations. Every 1 °C fluctuation can lead to approximately 0.2–0.3 nm variation in the pump source’s wavelength, accompanied by a noticeable decrease in the lifespan [
25]. Therefore, the temperature control accuracy should be less than 0.1 °C. To mitigate thermal effects during laser operation while meeting low-power usage conditions, this study adopts a controlled constant current source for pulse output. This tailored electronic design ensures optimal performance and reliability of the microchip laser in the challenging conditions of deep space exploration.
The electronic driving system comprises a control unit, a pulse constant current source system, a temperature control system, and a protection circuit. The overall structure is shown in
Figure 5. The control circuit generates a reference signal, feeding it to the pulse constant current source system and the temperature control system to produce the required current based on the settings. It also engages in communication with the upper computer to monitor the laser’s operational status in real-time. The pulse constant current source circuit operates to generate controlled and stable pulse current, facilitating proper laser operation. Simultaneously, the temperature control system upholds the microchip laser’s operation under specified temperature conditions. The protection circuit is intricately designed to avert damage to the laser in the event of sudden system issues or abnormal conditions, ensuring the laser’s safety and longevity.
The control unit is equipped with a high-level anti-radiation microcontroller, and its structure is illustrated in
Figure 6. Leveraging the built-in PCA (Pulse-Code Modulation) and DAC0 (Digital-to-Analog Converter), it governs the amplitude, frequency, and duty cycle of the output current. The synthesized reference signal is dispatched to the subsequent pulse constant current source system through analog switches, allowing users to adjust the parameters of the output current based on different application scenarios for the laser. DAC1 provides a reference voltage to the temperature control system, facilitating temperature regulation. Two ADC (Analogl-to-Digita Converter) channels are employed to collect parameters related to current and temperature, which are then conveyed to the upper computer for display. This sophisticated control unit design ensures precise and flexible control of the microchip laser, adapting to various operational requirements in deep space exploration missions.
The pulse constant current source system is depicted in
Figure 7, and its operational workflow is approximately as follows: Initially, as the control unit provides the reference signal, the driving voltage (V
G) starts to increase gradually from zero. When it exceeds the threshold voltage (V
th), the drain current of the MOSFET begins to appear, and simultaneously, the load current (I
L) is generated. As V
G increases, I
L also gradually increases until the current reaches the rated value as required by the reference signal, as detected by the current-sensing resistor. Afterward, the system continuously regulates the current to meet the requirements of the reference signal. This dynamic control mechanism ensures precise and stable pulse current output for optimal performance of the microchip laser in various operational scenarios.
The drive for the laser necessitates a sufficiently short rise time of a large current, a challenge that conventional DC-DC converters find difficult to address directly. Therefore, an energy storage system is selected as the implementation scheme to store energy, leveraging the discharge characteristics of a capacitor to supply instantaneous current. This approach not only fulfills the requirements of driving the laser but also alleviates the demands on the transient power of the external power source, meeting power limitations in deep space exploration applications. To maintain a minimal voltage drop across the laser terminals during operation, it is typically required that the voltage drop of the energy storage capacitor does not exceed 10% during discharge. According to
the required capacitance value can be calculated. Here,
represents the required current,
is the pulse duration of the current, and
is the permissible voltage drop across the energy storage capacitor.
The core of the pulse constant current source system lies in the Metal-Oxide-Semiconductor Field-Effect Transistor (MOSFET). Its operation in the linear region is harnessed to control the drain current by manipulating the gate voltage. In this configuration, the current exhibits constant characteristics, and the MOSFET responds rapidly to changes in the gate voltage. Moreover, it demonstrates good linearity in response to gate voltage variations, facilitating precise control of the output current. Since the MOSFET operates in the linear region, it needs to endure a certain voltage drop. It is crucial to ensure that it consistently operates within the Forward Biased Safe Operation Area. Additionally, when operating in the saturation region, devices with lower ON resistance should be chosen to minimize power dissipation on the MOSFET.
Due to the short duration of the pulse current during laser operation, a high bandwidth requirement exists for the driving system. Consequently, the pulse constant current source system employs analog loop compensation, offering a larger bandwidth compared to digital loop compensation. To enhance the accuracy and stability of the pulse current, a proportional-integral-derivative (PID) control algorithm is employed to regulate the system. It adjusts the system’s response speed through the proportional and integral terms, enabling it to respond more rapidly to changes in the input signal and adapt to the requirements of high-bandwidth short-pulse applications. Additionally, the derivative term suppresses system oscillations, ensuring stability and smooth operation. Following Formula (2) below,
represents proportional gain,
represents integral time constant, and
represents derivative time constant. The compensating network incorporates a system compensating poles and zeros. It provides a high gain in the low-frequency range, enhancing the open-loop gain of the system, while rapidly attenuating the loop gain in the high-frequency range. In practical adjustment, it is advisable to start by adjusting the proportional coefficient from the middle toward both ends. Subsequently, incrementally increase the integral coefficient and derivative coefficient from zero until a smooth response curve is observed, indicating that the laser driver has entered the desired operational state. This sophisticated control strategy ensures precise and efficient pulse current delivery, meeting the demanding requirements of laser operation in deep space exploration missions.
To achieve fast turn-on and turn-off of the MOSFET, shortening the rising and falling edges of the pulse current, gate current is required for the gate-source and gate-drain capacitance to charge and discharge. However, the operational amplifier’s drive capability is limited. Therefore, an Output Capacitor-Less (OCL) circuit is introduced after PID control in the pulse constant current source to enhance the drive capability of the MOSFET.
For the temperature control system, high-grade integrated temperature control chips are selected to achieve a balance between temperature control accuracy, low power consumption, and compact design. These chips offer high integration, small size, high precision, and excellent safety. The control diagram is illustrated in
Figure 8. Utilizing its internally stabilized zero-crossing wave operational amplifier and integral amplifier, it forms a PID regulation system. One input terminal imports the voltage value for the set temperature from the microcontroller’s DAC through a bridge circuit, while the other input terminal is connected to a Negative Temperature Coefficient Thermistor (NTC) to collect the real-time voltage value corresponding to the temperature. After processing by the PID controller, the driving current for controlling the Thermoelectric Cooler (TEC) is provided through a Field Effect Transistor (FET). To ensure the cooling efficiency and longevity of the laser, a high-quality semiconductor cooler was selected. It features 71 pairs of thermoelectric couples and has dimensions of 31.3 × 17.6 × 3 mm
3, matching the area of the oxygen-free copper baseplate in the laser system, thereby minimizing heat dissipation power consumption.