The layout and the main design parameters of an embedded CSIW resonator are shown in
Figure 1. Such a structure consists of a square or circular SIW cavity where several plated via holes have been inserted at the center of the cavity resonator, as was first introduced in [
4], and then demonstrated in [
5,
6]. By connecting one end of it via holes to ground, the inductive section of a coaxial resonator is created and controlled by adjusting the position and the diameter
of the via holes. Conversely, at the other end of the via holes, a circular metal plate with radius
is introduced, as shown in
Figure 1b. Such a metal plate is located right below the external top metal layer, which is basically a ground plane, creating a small separating gap filled with dielectric material that we named
(visible in
Figure 1c).
By doing that, the strong electric field across the gap
creates the integrated
of a typical combline configuration. This topology enables the implementation of extremely high loading capacitances
towards ground, because it is possible to increase the disk plate area considerably while keeping
as narrow as possible. The capacitive component of the CSIW can be clearly seen by observing the field line distribution shown in
Figure 2. It is worth mentioning that in the selected LTCC fabrication process,
depends on the number and thickness of the dielectric tape layers that separate the circular disk plate from the top ground plane.
In addition, the electrical length of the coaxial transmission line embedded into the substrate depends on the final stack-up thickness, thus becoming an important design parameter since it controls both resonant frequency and unloaded
Q (
) of the CSIW resonator [
5]. Finally, the inner via holes with diameter
have been symmetrically placed around the cavity center to emulate a wider circular inner conductor that would show a fictitious diameter named
(see
Figure 1b). The further apart the via holes are, the larger the diameter
. This enables us to finely set
by using only the recommended value for
that, in the LTCC manufacturing, should be similar to the dielectric tape thickness to enable a good via filling process.
2.1. Synthesis
As proposed in [
9,
14] for the CSIW topology with a loading capacitance created by an air isolating gap, the resonator main parameters can be extracted straightforwardly, considering it as a piece of circular-square coaxial line of length
(where
) and characteristic admittance
embedded into the dielectric substrate. Then, such elements can be modeled as a TEM-mode transmission line short-circuited at one end and terminated with a capacitor on the other. Therefore, the TEM-mode resonant frequency is given by the condition
, being the susceptance
B of the coaxial resonator defined as
where
is the TEM-mode propagation constant, and
is the coaxial resonator characteristic impedance. It should be noted that the resonator electrical length
at the desired working frequency
corresponds to
.
Next, the characteristic impedance
of the CSIW resonator, and the proportion between the SIW cavity side
and
value are obtained from [
14] as
Thus, the synthesis procedure proceeds by setting the resonator slope parameter
b at center frequency
of the desired filtering response. As has been explained in [
15], the susceptance slope parameter
b for resonators with zero susceptance at
is well approximated by
On the one hand, the coaxial line admittance
can be calculated by using the approximation proposed in [
16] for a circular inner conductor of diameter
and an external square contour of side
, which is
where
is the dielectric substrate permittivity of the LTCC dielectric tape.
On the other hand, the loading capacitance
between the circular disk and the top metal layer may be written as
where
is the permittivity of the free space,
is the associated parallel plate capacitance, and
is the capacitance due to the fringing effect of the field between the edges of the plates, which are visible in the right part of
Figure 2. A correcting factor has been taken into account, due to the specific configuration of the implemented parallel plate capacitor of the CSIW resonator that shows only one circular disk plate. Indeed, the other plate consists of the wider top ground plate. Thus, as demonstrated in [
17], the fringing effect of a parallel plate capacitor composed of two identical circular disks can be well approximated as
Finally, to finely tune , a quick optimization of the circular disk plate radius by means of 3D EM simulations is usually required, which includes the metal layer thickness t of the conducting layer that forms the plate.
2.2. Resonator 3D EM Simulations
To perform the study of the performance of a CSIW resonator, let us consider a benchmark configuration with center frequency
GHz and using a 10-layer LTCC stack-up, whose layout has been already shown in
Figure 1. Regarding the dielectric material, the DuPont™ Green Tape™ 9K7 substrate (
, tan
@ 10 GHz) has been chosen due to its very low loss tangent. Each dielectric tape layer has a thickness of 0.254 mm in the green state, while the fired thickness is 0.224 mm on account of the shrinkage effect in the
z-direction after the LTCC firing step. This means that the total thickness of the 10-layer stack-up of the CSIW resonator is 2.24 mm.
Since we wanted to boost the miniaturization of the device with respect to standard SIW structures, we set a high value for the slope parameter, which is
mS. As a result, the main parameters of the CSIW resonator become:
pF and
. The main dimensions of the compact CSIW resonator considered in this study are shown in
Table 1, where
is the pitch between adjacent via holes forming the cavity sides. It is worth mentioning that the value of the capacitor plate separation (i.e.,
mm) has been achieved by introducing the circular disk plate after two dielectric tape layers below the external top metal layer in the stack-up. Thus, the length of the embedded coaxial line is
mm
mm)
mm, which corresponds to an electrical length of
@ 1.5 GHz.
These values emphasize the remarkable degree of miniaturization that can be simply achievable with the CSIW topology. Indeed, the SIW cavity side is just mm, which corresponds to and , where is the guided wavelength at GHz.
The simulated frequency response of the designed device, which has been obtained by using ANSYS HFSS software, is depicted in
Figure 3a, and it is compared to the frequency response of a standard TE
-based SIW resonator having the same cavity size in
Figure 3b. As shown, the use of an embedded CSIW topology enables also the shifting down of the fundamental mode of the SIW cavity resonator (i.e., the TEM mode in a CSIW resonator) with respect to the first spurious mode, which is the TE
mode, thus widening the stop-band bandwidth. Indeed, the EM field of the first spurious mode is altered due to the inner via holes and capacitive patch that provoke an increase of its resonant frequency, from 8.79 GHz as fundamental mode of a TE
-based resonator to 11.6 GHz as first spurious mode of the CSIW resonator. Thus, in the proposed simulated CSIW structure, the stop-band bandwidth is greater than
, as can be seen in
Figure 3b.
Furthermore,
Figure 4 shows how the resonant frequency (
) and
of the CSIW resonator change as the function of the radius
of the capacitive disk, which means modifying the total
value. It is evident that the resonant frequency can be controlled over a wide frequency band (i.e., >1.5 GHz) without affecting the overall resonator dimensions, while keeping a constant
over frequency.
In this context,
Table 2 provides the comparison between
, area miniaturization factor (MF, which has been defined in [
18]) and spurious-free band of the designed embedded CSIW resonator and standard TE
-based SIW cavity resonators, centered also at
GHz and implemented in the very same LTCC stack-up.
Specifically, the MF for a particular miniaturized resonator operating at
of is calculated using
where
is the area of a standard TE
SIW resonator centered at
and
is the area of the proposed CSIW resonator.
Please note that two thickness layers have been considered for the standard SIW implementation to evaluate the effect on the
. As shown in
Table 2, CSIW topology enables extremely high miniaturization of the resonator with moderate degradation of
and improved stop-band performance.
2.3. Coupling Mechanisms
Figure 5 depicts the topology of the novel magnetic coupling mechanism that is especially suited for obtaining strong coupling values in highly loaded CSIW resonators. Specifically,
Figure 5a shows the layout of the magnetic external coupling mechanism, while the inter-resonator coupling mechanism is shown in
Figure 5b. As reflected, the magnetic couplings are based on embedded stripline probes that are arranged at different layers of the LTCC stack-up, so that inner conductors of adjacent CSIW resonators can be short-circuited between them in a similar manner to conventional tapped-line couplings widely used in combline planar filters. Thus, this solution exploits the high flexibility of the LTCC multi-layer technology to improve the performance of CSIW filters.
By changing the height of the interconnection between coupling probes and the plated via holes forming the inner conductor, the coupling magnitude can be coarsely tuned, as shown in
Figure 6. In this context, let us name the height position in the stack-up of the external and the inter-resonator couplings as
and
, respectively. In addition, let us set
mm at the external bottom level and
mm at the external top level, for
.
In
Figure 6a, the external quality factor (
) is represented as functions of
, while the inter-resonator coupling coefficient (
) between two adjacent resonators versus
is shown in
Figure 6b. Taking into account that the height position of the circular disk plate corresponds to
mm, the highest coupling value is achieved when the stripline probes are short-circuited to this capacitive plate element. By contrast, the coupling drops quickly as the probe is moved towards the bottom layer. Please note that such coupling values enable the design of wideband BPF with FBW easily higher than
.
Nevertheless, a fine tuning of both couplings is achieved by varying the stripline probe width, which are named
for external coupling and
for inter-resonator coupling, as it can be seen in
Figure 7a,b, respectively. Thus, once the height position of the coupling probes is defined in the LTCC stack-up, the probe widths allow us to finely control
and
values, enabling a good optimization of the filtering response.
2.4. 3D EM Simulations of the Filter
To validate the concept, a CSIW BPF has been designed and simulated. The CSIW resonator previously introduced is the building block of this three-pole BPF whose frequency response will be centered at the L-band.
Figure 8a shows the layout of the BPF including its main dimensions. Blue elements highlight the coupling mechanisms, and cover pads that keep an excellent electrical connection among via holes forming the SIW cavity walls on different layers. It should be noted that external and inter-resonator coupling have been accommodated on the very same layer (i.e.,
mm) thus allowing for a stack-up simplification and manufacturing cost reduction. Indeed, the designed CSIW components have been included in a multi-project LTCC fabrication run that had an already predefined LTCC stack-up. In this context, the inner conductor printing was only allowed at
mm, which limits the filter design flexibility. However, optimized values of the coupling coefficients have been easily obtained by adjusting the probe widths
and
.
We have chosen to design a direct-coupled three-pole Chebyshev filtering response centered at
GHz with an equi-ripple bandwidth (BW) of 150 MHz, which corresponds to FBW
and return loss (RL) of 15 dB. Thus, the coupling coefficients associated with the target response are
, and
.
Figure 8b depicts the simulated filtering response. In the passband, the minimum insertion loss (IL) is 1.2 dB at 1.49 GHz, while RL are better than 14.5 dB. Finally, the main dimensions of the filter are detailed in
Table 3.