He, P.-S.; Tran, D.-P.; Kuo, T.-Y.; Hsu, W.-Y.; Lin, H.-E.; Shie, K.-C.; Chen, C.
High-Bonding-Strength Polyimide Films Achieved via Thermal Management and Surface Activation. Nanomaterials 2023, 13, 1575.
https://doi.org/10.3390/nano13091575
AMA Style
He P-S, Tran D-P, Kuo T-Y, Hsu W-Y, Lin H-E, Shie K-C, Chen C.
High-Bonding-Strength Polyimide Films Achieved via Thermal Management and Surface Activation. Nanomaterials. 2023; 13(9):1575.
https://doi.org/10.3390/nano13091575
Chicago/Turabian Style
He, Pin-Syuan, Dinh-Phuc Tran, Ting-Yu Kuo, Wei-You Hsu, Huai-En Lin, Kai-Cheng Shie, and Chih Chen.
2023. "High-Bonding-Strength Polyimide Films Achieved via Thermal Management and Surface Activation" Nanomaterials 13, no. 9: 1575.
https://doi.org/10.3390/nano13091575
APA Style
He, P. -S., Tran, D. -P., Kuo, T. -Y., Hsu, W. -Y., Lin, H. -E., Shie, K. -C., & Chen, C.
(2023). High-Bonding-Strength Polyimide Films Achieved via Thermal Management and Surface Activation. Nanomaterials, 13(9), 1575.
https://doi.org/10.3390/nano13091575
