Wu, W.; Li, G.; Wang, S.; Wang, Y.; Feng, J.; Sun, X.; Tian, Y.
Study on the Solder Joint Reliability of New Diamond Chip Resistors for Power Devices. Coatings 2023, 13, 748.
https://doi.org/10.3390/coatings13040748
AMA Style
Wu W, Li G, Wang S, Wang Y, Feng J, Sun X, Tian Y.
Study on the Solder Joint Reliability of New Diamond Chip Resistors for Power Devices. Coatings. 2023; 13(4):748.
https://doi.org/10.3390/coatings13040748
Chicago/Turabian Style
Wu, Wenyu, Geng Li, Shang Wang, Yiping Wang, Jiayun Feng, Xiaowei Sun, and Yanhong Tian.
2023. "Study on the Solder Joint Reliability of New Diamond Chip Resistors for Power Devices" Coatings 13, no. 4: 748.
https://doi.org/10.3390/coatings13040748
APA Style
Wu, W., Li, G., Wang, S., Wang, Y., Feng, J., Sun, X., & Tian, Y.
(2023). Study on the Solder Joint Reliability of New Diamond Chip Resistors for Power Devices. Coatings, 13(4), 748.
https://doi.org/10.3390/coatings13040748