Thermal barrier coating (TBC) is one of the most widely used multilayer coating systems of gas turbines in aerospace, energy and other fields to improve the efficiency and prolong the lifetime of components by reducing their temperature and enhancing oxidation resistance [
1]. TBC is usually composed of the ceramic (yttria partially stabilized zirconia (YSZ)) top coat and MCrAlY (M is Co, Ni or both) bond coat. These coatings are applied by electron beam physical vapor deposition (EB-PVD) or plasma spray (PS) technology [
2,
3]. The bond coat plays an important role in the TBC system, which improves the physical compatibility between the ceramic top coat and the substrate, and thus the ceramic top coat can combine closely with the substrate. Moreover, elements in the bond coat diffuse to the ceramic top coat and the bond coat (TC/BC) interface to react with oxygen, and the thermally grown oxide (TGO), which is the mixture of Al, Cr and Co oxides, is formed during high-temperature exposure. The continuous and dense oxide scale can enhance the high temperature oxidation resistance and hot corrosion resistance of components. Failure of the coating is related to the critical thickness of Al
2O
3 scale at the TC/BC interface; thus the main factor affecting the durability of a coating is recognized as the oxidation rate of the bond coat [
4]. The failure of TBC is related to the conversion from initial α-Al
2O
3 to α-Cr
2O
3 and (CoNi)(CrAl) spinel [
5]. The thermal stress caused by a thermal expansion coefficient mismatch between the spinel oxides and Al
2O
3 results in the formation of a crack at the interface of TC/TGO/BC [
6]. The oxidation resistance of TBC is determined by the dense Al
2O
3 with a slow growth rate, thus TBC with high Cr and Al contents can prevent itself from corrosion and oxidation [
7]. However, Cr and Co in the bond coat can also react with oxygen, and detrimental oxides like Co(Al,Cr)
2O
4 spinel are formed when severe Al depletion happens. Therefore, the continuous and dense oxide scale cannot be formed to protect the substrate, which can accelerate the failure of TBC [
6]. The formation of Cr and Co oxides is determined by the diffusion rate of Cr and Co as well as the growth rate of Al
2O
3. The oxidation behaviors of Cr and Co have an influence on the oxidation process of Al, in turn. Furthermore, the oxidation resistance of TBC is gradually reduced because of the consumption of Al and Cr in the bond coat [
8]. Most research related to the oxidation resistance of TBC focuses mainly on the growth behaviors of Al
2O
3 [
9,
10,
11]. It is reported by Keyvani [
10] that non-protective oxides are formed rapidly at the initial oxidation stage and the growth of TGO is under the diffusion control; and the effects of diffusion rate on the oxidation of Cr and Co in the Ni alloy are studied in detail by Allen [
12]. The failure of a TBC system depends on the TGO growth behaviors during the oxidation process [
11]. TGO growth causes volume variation at the TC/BC interface, which results in out-of-plane stress at the interface. The crack propagates in the TBC system through the opening and growth in the ceramic and the limited crack nucleation and propagation related to TGO [
13,
14]. However, there are a few investigations that pay attention to the effects of Cr and Co oxides on the TGO growth behavior. Therefore, it is of great significance to investigate the oxidation behaviors of Cr and Co in order to improve oxidation resistance and prolong the lifetime of TBC. Most research mainly pays attention to the temperature range of TBC from 1000 to 1200 °C by using EB-PVD technology. When the temperature is larger than 1170 °C, the volume expansion of phase conversion can result in the TBC cracking. Also, the YSZ agglomerates with the rise in temperature, and thus the failure of TBC can occur more easily at relatively high temperature [
15,
16]. This paper focuses on the investigation of the influence of Al, Cr and Co oxides on TGO growth behavior, and the failure of the TBC system is not expected to occur during the high-temperature exposure. Therefore, the test temperature needs to be set below 1170 °C. In this paper, the effects of oxidation behaviors of Cr and Co on TGO growth behavior at the TC/BC interface during high-temperature exposure at 1000 °C were studied. The paper is organized as follows. Firstly, the material and experimental design are introduced. Secondly, the kinetics of the high-temperature exposure are analyzed, respectively. Thirdly, the morphology and composition analysis of the oxide scales at the TC/BC interface are investigated. Finally, the oxidation thermodynamics are studied, and the conclusions are given.