Cherif, L.; Chentouf, M.; Benallal, J.; Darmi, M.; Elgouri, R.; Hmina, N.
A New Multi-Bit Flip-Flop Merging Mechanism for Power Consumption Reduction in the Physical Implementation Stage of ICs Conception. J. Low Power Electron. Appl. 2019, 9, 3.
https://doi.org/10.3390/jlpea9010003
AMA Style
Cherif L, Chentouf M, Benallal J, Darmi M, Elgouri R, Hmina N.
A New Multi-Bit Flip-Flop Merging Mechanism for Power Consumption Reduction in the Physical Implementation Stage of ICs Conception. Journal of Low Power Electronics and Applications. 2019; 9(1):3.
https://doi.org/10.3390/jlpea9010003
Chicago/Turabian Style
Cherif, Lekbir, Mohamed Chentouf, Jalal Benallal, Mohammed Darmi, Rachid Elgouri, and Nabil Hmina.
2019. "A New Multi-Bit Flip-Flop Merging Mechanism for Power Consumption Reduction in the Physical Implementation Stage of ICs Conception" Journal of Low Power Electronics and Applications 9, no. 1: 3.
https://doi.org/10.3390/jlpea9010003
APA Style
Cherif, L., Chentouf, M., Benallal, J., Darmi, M., Elgouri, R., & Hmina, N.
(2019). A New Multi-Bit Flip-Flop Merging Mechanism for Power Consumption Reduction in the Physical Implementation Stage of ICs Conception. Journal of Low Power Electronics and Applications, 9(1), 3.
https://doi.org/10.3390/jlpea9010003