Yan, L.; Yao, J.; Dai, Y.; Zhang, S.; Bai, W.; Gao, K.; Yang, H.; Wang, Y.
Study of Thermal Stress Fluctuations at the Die-Attach Solder Interface Using the Finite Element Method. Electronics 2022, 11, 62.
https://doi.org/10.3390/electronics11010062
AMA Style
Yan L, Yao J, Dai Y, Zhang S, Bai W, Gao K, Yang H, Wang Y.
Study of Thermal Stress Fluctuations at the Die-Attach Solder Interface Using the Finite Element Method. Electronics. 2022; 11(1):62.
https://doi.org/10.3390/electronics11010062
Chicago/Turabian Style
Yan, Luchun, Jiawen Yao, Yu Dai, Shanshan Zhang, Wangmin Bai, Kewei Gao, Huisheng Yang, and Yanbin Wang.
2022. "Study of Thermal Stress Fluctuations at the Die-Attach Solder Interface Using the Finite Element Method" Electronics 11, no. 1: 62.
https://doi.org/10.3390/electronics11010062
APA Style
Yan, L., Yao, J., Dai, Y., Zhang, S., Bai, W., Gao, K., Yang, H., & Wang, Y.
(2022). Study of Thermal Stress Fluctuations at the Die-Attach Solder Interface Using the Finite Element Method. Electronics, 11(1), 62.
https://doi.org/10.3390/electronics11010062