Lee, J.-M.; Seo, M.-S.; Kim, D.-H.; Lee, S.-W.; Park, J.-C.; Choi, D.-G.
Exploiting Features with Split-and-Share Module. Electronics 2022, 11, 235.
https://doi.org/10.3390/electronics11020235
AMA Style
Lee J-M, Seo M-S, Kim D-H, Lee S-W, Park J-C, Choi D-G.
Exploiting Features with Split-and-Share Module. Electronics. 2022; 11(2):235.
https://doi.org/10.3390/electronics11020235
Chicago/Turabian Style
Lee, Jae-Min, Min-Seok Seo, Dae-Han Kim, Sang-Woo Lee, Jong-Chan Park, and Dong-Geol Choi.
2022. "Exploiting Features with Split-and-Share Module" Electronics 11, no. 2: 235.
https://doi.org/10.3390/electronics11020235
APA Style
Lee, J. -M., Seo, M. -S., Kim, D. -H., Lee, S. -W., Park, J. -C., & Choi, D. -G.
(2022). Exploiting Features with Split-and-Share Module. Electronics, 11(2), 235.
https://doi.org/10.3390/electronics11020235