Leduc, R.; Ibrahimi, N.; Dienot, J.-M.; Gavrilenko, V.; Ruscassié, R.
Analytical and 3D Numerical Study of Multilayer Shielding Effectiveness for Board Level Shielding Optimization. Electronics 2022, 11, 4156.
https://doi.org/10.3390/electronics11244156
AMA Style
Leduc R, Ibrahimi N, Dienot J-M, Gavrilenko V, Ruscassié R.
Analytical and 3D Numerical Study of Multilayer Shielding Effectiveness for Board Level Shielding Optimization. Electronics. 2022; 11(24):4156.
https://doi.org/10.3390/electronics11244156
Chicago/Turabian Style
Leduc, Roman, Njomza Ibrahimi, Jean-Marc Dienot, Veronika Gavrilenko, and Robert Ruscassié.
2022. "Analytical and 3D Numerical Study of Multilayer Shielding Effectiveness for Board Level Shielding Optimization" Electronics 11, no. 24: 4156.
https://doi.org/10.3390/electronics11244156
APA Style
Leduc, R., Ibrahimi, N., Dienot, J. -M., Gavrilenko, V., & Ruscassié, R.
(2022). Analytical and 3D Numerical Study of Multilayer Shielding Effectiveness for Board Level Shielding Optimization. Electronics, 11(24), 4156.
https://doi.org/10.3390/electronics11244156