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Journal: Electronics, 2024
Volume: 13
Number: 1775

Article: Heat Dissipation Capability of Stagger-Stacked Double Data Rate Module
Authors: by Haiyan Sun, Dongqing Cang, Qi Zhang, Jicong Zhao and Zhikuang Cai
Link: https://www.mdpi.com/2079-9292/13/9/1775

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