Investigations on Material Loads during Grinding by Speckle Photography
Abstract
:1. Introduction
2. Materials and Methods
2.1. Material Loads
2.2. FEM Approach and Simulative Setup
2.3. Displacement and Strain Field Measurement with DSP
2.4. Experimental Setup
3. Results of In-Process Measurements and Simulations of Material Loads
4. Conclusions and Outlook
Author Contributions
Funding
Conflicts of Interest
References
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Tausendfreund, A.; Borchers, F.; Kohls, E.; Kuschel, S.; Stöbener, D.; Heinzel, C.; Fischer, A. Investigations on Material Loads during Grinding by Speckle Photography. J. Manuf. Mater. Process. 2018, 2, 71. https://doi.org/10.3390/jmmp2040071
Tausendfreund A, Borchers F, Kohls E, Kuschel S, Stöbener D, Heinzel C, Fischer A. Investigations on Material Loads during Grinding by Speckle Photography. Journal of Manufacturing and Materials Processing. 2018; 2(4):71. https://doi.org/10.3390/jmmp2040071
Chicago/Turabian StyleTausendfreund, Andreas, Florian Borchers, Ewald Kohls, Sven Kuschel, Dirk Stöbener, Carsten Heinzel, and Andreas Fischer. 2018. "Investigations on Material Loads during Grinding by Speckle Photography" Journal of Manufacturing and Materials Processing 2, no. 4: 71. https://doi.org/10.3390/jmmp2040071
APA StyleTausendfreund, A., Borchers, F., Kohls, E., Kuschel, S., Stöbener, D., Heinzel, C., & Fischer, A. (2018). Investigations on Material Loads during Grinding by Speckle Photography. Journal of Manufacturing and Materials Processing, 2(4), 71. https://doi.org/10.3390/jmmp2040071