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Design, Development and Application of Microelectronics and Semiconductor Devices

A special issue of Applied Sciences (ISSN 2076-3417). This special issue belongs to the section "Applied Physics General".

Deadline for manuscript submissions: 10 May 2025 | Viewed by 488

Special Issue Editors


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Guest Editor
Faculty of Electrical and Electronic Engineering, Universidad Veracruzana, Boca del Río 94294, Veracruz, Mexico
Interests: design and modelling of MEMS; integrated circuits and microsensors characterization for biomedical, environment and industrial applications; energy harvesting devices
Special Issues, Collections and Topics in MDPI journals

E-Mail Website
Guest Editor
CONAHCYT, Universidad Autónoma del Estado de Quintana Roo, Chetumal 77019, Quintana Roo, Mexico
Interests: advanced microelectronics and semiconductors, advancing renewable energy technologies and environmental sensing; development and detailed analysis of porous semiconductor materials for improved solar cell efficiency and fabrication of sensitive biological and chemical sensors; exploration and optimization of solar energy harvesting techniques; design of low-power devices for the Internet of Things (IoT); prioritizing sustainability and energy conservation; sustainable wireless sensor networks powered by innovative energy sources such as microbial fuel cells, contributing to environmental monitoring and development of smart, energy-efficient technologies

E-Mail Website
Guest Editor
Faculty of Electrical and Electronic Engineering, Universidad Veracruzana, Boca del Río 94294, Veracruz, Mexico
Interests: analog and digital electronics design; thin solid films for chemical and environmental sensors; nanostructured materials analysis; embedded systems; sequential and RTOS microcontroller programming

E-Mail Website
Guest Editor
Department of Energy Technology, Aalborg University, Aalborg, Denmark
Interests: power electronics; power semiconductors; reliability of power electronics; thermal modeling; thermal characterization; machine learning; modular multilevel converters; condition monitoring

Special Issue Information

Dear Colleagues,

Research on innovative technologies for new materials and semiconductors has significantly increased, driven by the expansion of microprocessors, smart devices, sensors, and consumer electronics connected to the Internet of Things (IoT) in the digital era. The prospects are stimulating, but several challenges are emerging. One such challenge is related to the energy consumption of these devices, their speed, and reliability. The enhanced integration of new thin film technologies with VLSI has been suggested, as well as the development of novel transistors for the creation of modern circuits. Therefore, this collection considers recent advances in the design, modeling, fabrication, characterization, applications, and perspectives of microelectronic and semiconductor devices. It focuses on how these developments can address current and future challenges, promoting innovative solutions that optimize performance and energy efficiency, while exploring emerging applications across various fields of science and technology.

Dr. Francisco López-Huerta
Dr. Edith Osorio de la Rosa
Dr. Rosa Maria Woo García
Dr. Yi Zhang
Guest Editors

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Applied Sciences is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2400 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • microelectronics
  • semiconductor devices
  • thin film technologies
  • VLSI
  • IoT
  • energy consumption
  • reliability
  • circuit design
  • modeling and fabrication
  • emerging applications

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Published Papers

This special issue is now open for submission.
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