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State-of-the-Art Structural Health Monitoring Application

A special issue of Applied Sciences (ISSN 2076-3417). This special issue belongs to the section "Civil Engineering".

Deadline for manuscript submissions: 20 May 2025 | Viewed by 93

Special Issue Editors


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Guest Editor
College of Engineering, Birmingham City University, Birmingham B4 7XG, UK
Interests: signal processing; machine learning; structural health monitoring; electronics systems; intelligent systems
Special Issues, Collections and Topics in MDPI journals

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Guest Editor
Department of Engineering, University of Campania “Luigi Vanvitelli”, 81031 Aversa, Italy
Interests: structural health monitoring; FRP composite materials; finite element analysis (FEA); crashworthiness; structural behavior
Special Issues, Collections and Topics in MDPI journals

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Guest Editor
Campus of São João da Boa Vista/SP, School of Engineering, São Paulo State University (UNESP), São Paulo 15385-000, Brazil
Interests: structural health monitoring; sensors; speech; signal processing; instrumentation

Special Issue Information

Dear Colleagues,

The recent advancements in structural health monitoring (SHM) systems have significantly enhanced the capability to continuously monitor diverse types of structures (differing in shape and material) and detect, identify, and localise anomalies, aiming to estimate the remaining useful life (RUL) of these structures. This progress is crucial for preventing accidents and reducing maintenance costs. For this purpose, new technologies in sensing allied to AI/machine learning algorithms, alongside IoT technologies, play a pivotal role in the development of net real-time SHM systems. These innovations have expanded the practicality and efficiency of SHM, making it more accurate and versatile across a range of applications, including wind turbines, rotor systems, aircraft, bridges, and buildings.

This Special Issue will explore emerging trends, novel methodologies, and cutting-edge technologies that are reshaping the SHM landscape, including, but not limited to, the following:

  • Advanced sensing technologies;
  • Data processing and analytics;
  • Non-destructive testing (NDT) methods;
  • Digital twins and IoT integration.

Dr. Mario De Oliveira
Dr. Donato Perfetto
Dr. Jozue Vieira Filho
Guest Editors

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Applied Sciences is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2400 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • structural health monitoring (SHM)
  • AI/machine learning
  • sensing technology
  • real-time SHM systems
  • embedded systems for SHM
  • digital twins
  • rotor systems
  • EOV/wind turbine
  • remaining useful life methods
  • IoT solutions for SHM

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Published Papers

This special issue is now open for submission.
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