Physics and Mechanics of New Materials and Their Applications
A special issue of Applied Sciences (ISSN 2076-3417).
Deadline for manuscript submissions: closed (15 November 2018) | Viewed by 30494
Special Issue Editors
Interests: mechanical engineering; composite materials
Special Issues, Collections and Topics in MDPI journals
Interests: mechanical engineering; solid state physics; materials physics; materials science; superconductors; piezoceramics; piezoelectric ceramics; superconductivity; microstructure
Special Issues, Collections and Topics in MDPI journals
Interests: signal processing; electrical engineering; signal analysis; time–frequency analysis; transducers; ultrasonics; piezoelectricity; array signal processing; adaptive beamforming
Special Issues, Collections and Topics in MDPI journals
Interests: analog IC design; circuit theory; analysis and synthesis; applied electronics design; signal processing
Special Issues, Collections and Topics in MDPI journals
Special Issue Information
Dear Colleagues,
To boost the development of artificial intelligent technology, better performance of sensing devices and successive signal processing are prerequisites. For enhancing the performance of sensing devices, the mechanical investigation of related materials, circuits and applications are critical. The present Special Issue aims to explore new trends in physics and the mechanics of new materials and their applications. A certain number of contributions for this Special Issue will come from selected papers of PHENMA 2018 Busan, the 7th “International conference on Physics and Mechanics of New Materials and Their Applications”.
https://phenma2018.wordpress.com
Topics of interest (among others) include:
Materials: Ferro-Piezoelectrics, Semiconductors, High-temperature Superconductors, Environmental Materials, Medical Materials, Composite, Ceramics, Thin Films, Nanomaterials, New Materials for Additive Manufacturing, etc.
Energy Harvesting: Materials, Methods and Applications
Synthesis and Processing: Powder Processing, Processing Technologies, Piezoelectric Technologies, MEMS-Processing, etc.
Characterization and Research Methods: Microstructure Properties, Physical Properties, Mechanical Properties, Strength Properties, Finite-Element Modeling, Mathematical Modeling, Physical Modeling, Physical Experiment, etc.
Applications: MEMS, Hetero-structures, Piezotransducers, Piezoactuators, Piezogenerators, Superconductive Devices, Light-Emitting Diodes, Multimedia Communication, Fiber Reinforced Composites, condition monitoring, Lubricant and Tribology, etc.
Underwater Technologies: Underwater Communication, Marine Engineering, Power System, Ocean Energy, etc.
Prof. Yun-Hae Kim
Prof. Ivan A. Parinov
Prof. Shun-Hsyung Chang
Prof. Hung-Yu Wang
Guest Editors
Manuscript Submission Information
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