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Advances in Polyimide Films: Preparation, Properties and Applications
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Advances in Polyimide Films: Preparation, Properties and Applications

A special issue of Applied Sciences (ISSN 2076-3417). This special issue belongs to the section "Chemical and Molecular Sciences".

Deadline for manuscript submissions: closed (31 December 2018) | Viewed by 32648

Special Issue Editor

Prof. Dr. Chan-Moon Chung

E-Mail Website
Guest Editor
Department of Chemistry and Medical Chemistry, Yonsei University Mirae Campus, Wonju, Korea
Interests: polyimides; self-healing polymers; nanocomposites
Special Issues, Collections and Topics in MDPI journals

Special Issue Information

Dear Colleagues,

Polyimide films have experienced rapid development in recent years, the major emphasis being on engineering applications. The ability of polyimide films to maintain their excellent electrical, thermal, physical and chemical properties over a wide temperature range has opened new design and application areas to plastic films. The polyimide films have been used in a variety of electrical and electronic insulation applications in various industries such as aerospace, energy, automotive and electronics. There has recently been an intense effort to develop flexible and transparent plastic substrates suitable for applications in conformable and roll-up displays. Polyimide films have been regarded as a potential candidate for the substrate owing their excellent mechanical, thermal, chemical and electrical properties.

This Special Issue on “Advances in Polyimide Films: Preparation, Properties and Applications” is dedicated to recent advances in research and development of polyimide films. Research articles on the latest research work in this area, with emphasis on preparation, properties or applications are invited.

Prof. Dr. Chan-Moon Chung
Guest Editor

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

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Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2400 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • Synthesis method
  • Polyimide films
  • Composite films
  • Preparation
  • Properties
  • Applications

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Published Papers (5 papers)

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Research

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12 pages, 4762 KiB  
Article
Preparation and Characterization of High Thermal Conductivity and Low CTE Polyimide Composite Reinforced with Diamond Nanoparticles/SiC Whiskers for 3D IC Interposer RDL Dielectric
by Jiangbo Luo, Yongpeng Wu, Yunna Sun, Guilian Wang, Yanmei Liu, Xiaolin Zhao and Guifu Ding
Appl. Sci. 2019, 9(9), 1962; https://doi.org/10.3390/app9091962 - 13 May 2019
Cited by 12 | Viewed by 7057
Abstract
Low thermal conductivity and large coefficient of thermal expansion (CTE) are the most serious disadvantages of the polymer dielectric for the interposer redistribution layer (RDL). In this paper, a high thermal conductivity and low CTE composite with polyimide (PI) matrix and diamond nanoparticles/SiC [...] Read more.
Low thermal conductivity and large coefficient of thermal expansion (CTE) are the most serious disadvantages of the polymer dielectric for the interposer redistribution layer (RDL). In this paper, a high thermal conductivity and low CTE composite with polyimide (PI) matrix and diamond nanoparticles/SiC whiskers reinforcement is proposed. The preparation and characterization of the composite film are presented and the effects of the composite on the improvement of the interposer properties are investigated. With 10 wt% diamond-nanoparticles and 7 wt% SiC-whiskers, the composite film has a thermal conductivity of 1.63 W/m·K and a CTE of 16.7 ppm/°C (compared with 0.19 W/m·K and 55.6 ppm/°C of the PI). Interposers with PI RDL dielectric and the composite RDL dielectric are fabricated, respectively. The simulation result shows that the composite dielectric can significantly enhance the properties of the interposer compared with the PI dielectric. The thermal resistance of the interposer decreases from 8.04 °C/W to 1.15 °C/W. The maximum von Mises stress decreases from 72.8 MPa to 16.9 MPa and the warpage decreases from 1.13 μm to 0.15 μm. Thermal distribution tests are performed as well. The results show that the maximum temperature of the interposer decreases from 64 °C to 45.1 °C. The composite developed in this study can reduce the temperature and enhance the reliability of the chips with interposers. It has the potential to expand the application of the interposers in high thermal density integration and high reliability devices. Full article
(This article belongs to the Special Issue Advances in Polyimide Films: Preparation, Properties and Applications)
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9 pages, 3366 KiB  
Article
Study on the Thermal Properties and Enzymatic Degradability of Chiral Polyamide-Imides Films Based on Amino Acids
by Weipeng Liu, Fuyan He, Wenke Yang, Zhizhou Yang, Jinshui Yao and Hui Zhao
Appl. Sci. 2019, 9(3), 578; https://doi.org/10.3390/app9030578 - 10 Feb 2019
Cited by 5 | Viewed by 2617
Abstract
Six kinds of chiral polyamide-imides (PAI3a–3f) have successfully been synthesized via direct polycondensation. The thermal properties of the materials were evaluated by the gravimetric analysis (TGA) and differential scanning calorimetry (DSC). A thermal test was conducted and showed that the polymers have good [...] Read more.
Six kinds of chiral polyamide-imides (PAI3a–3f) have successfully been synthesized via direct polycondensation. The thermal properties of the materials were evaluated by the gravimetric analysis (TGA) and differential scanning calorimetry (DSC). A thermal test was conducted and showed that the polymers have good thermal stability. The Tg values were affected by the volume effect of the side groups, the internal plasticizing effect and the isolation effect. Polyamide-imides (PAIs) with L configuration showed higher Tg values than PAIs with D configuration. In the enzymatic degradation experiments of PAI films, the results showed that the structure of amino acids have the greatest influence on the degradation performance of PAIs relative to chirality. The PAI films with simple side groups and L configurations were easier to degrade. The degradation rate of natural chiral PAIs were higher than those of non-natural chiral PAIs. This makes it possible to develop polymer materials with specific degradation rates. Full article
(This article belongs to the Special Issue Advances in Polyimide Films: Preparation, Properties and Applications)
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11 pages, 3094 KiB  
Article
Preparation and Properties of Poly(imide-siloxane) Copolymer Composite Films with Micro-Al2O3 Particles
by Ju-Young Choi, Kyeong-Nam Nam, Seung-Won Jin, Dong-Min Kim, In-Ho Song, Hyeong-Joo Park, Sungjin Park and Chan-Moon Chung
Appl. Sci. 2019, 9(3), 548; https://doi.org/10.3390/app9030548 - 6 Feb 2019
Cited by 9 | Viewed by 4603
Abstract
In the current study, poly(imide-siloxane) copolymers (PIs) with different siloxane contents were synthesized and used as a matrix material for PI/Al2O3 composites. The PIs were characterized via their molecular weight, film quality, and thermal stability. Among the PI films, free-standing [...] Read more.
In the current study, poly(imide-siloxane) copolymers (PIs) with different siloxane contents were synthesized and used as a matrix material for PI/Al2O3 composites. The PIs were characterized via their molecular weight, film quality, and thermal stability. Among the PI films, free-standing and flexible PI films were selected and used to prepare PI/Al2O3 composite films, with different Al2O3 loadings. The thermal conductivity, thermal stability, mechanical property, film flexibility, and morphology of the PI/Al2O3 composite films were investigated for their application as heat-dissipating material. Full article
(This article belongs to the Special Issue Advances in Polyimide Films: Preparation, Properties and Applications)
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8 pages, 2485 KiB  
Article
Highly Efficient, Flexible, and Recyclable Air Filters Using Polyimide Films with Patterned Thru-Holes Fabricated by Ion Milling
by Sang-Jun Choi, Kyung ho Kim, Hyun jin Kim, Jun Soo Yoon, Mi jung Lee, Kyung-Suk Choi, Ung-Dae Sung, Won-Taek Park, Jeongjun Lee, Jihyun Jeon, Jaehyuk Im, Kyoung-Kook Kim and Soohaeng Cho
Appl. Sci. 2019, 9(2), 235; https://doi.org/10.3390/app9020235 - 10 Jan 2019
Cited by 8 | Viewed by 5523
Abstract
We present the first demonstration of the environmental application of a polyimide film (Kapton) with patterned thru-holes as a novel, efficient, flexible, recyclable, and active particulate matter (PM) air filter. The Kapton air filter captures PM using micro-sized thru-holes and the strong electrostatic [...] Read more.
We present the first demonstration of the environmental application of a polyimide film (Kapton) with patterned thru-holes as a novel, efficient, flexible, recyclable, and active particulate matter (PM) air filter. The Kapton air filter captures PM using micro-sized thru-holes and the strong electrostatic force because of its high work function. It is highly efficient, transparent, flexible, and heat-resistant. Furthermore, it can be recycled simply by washing it with tap water. The proposed PM filter is a promising candidate for use as a highly efficient and economical recyclable air filter for home appliances, such as air-purifiers, air-conditioners, and humidifiers, as well as industrial filtration systems. Full article
(This article belongs to the Special Issue Advances in Polyimide Films: Preparation, Properties and Applications)
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Review

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23 pages, 2005 KiB  
Review
Review of Radiation-Induced Effects in Polyimide
by Elena A. Plis, Daniel P. Engelhart, Russell Cooper, W. Robert Johnston, Dale Ferguson and Ryan Hoffmann
Appl. Sci. 2019, 9(10), 1999; https://doi.org/10.3390/app9101999 - 16 May 2019
Cited by 75 | Viewed by 11633
Abstract
Polyimide (PI, Kapton-H®) films are widely utilized in the spacecraft industry for their insulating properties, mechanical durability, light weight, and chemical resistance to radiation. Still PI materials remain exposed to a combination of high-energy electrons, protons, and ultraviolet (UV) photons, particles [...] Read more.
Polyimide (PI, Kapton-H®) films are widely utilized in the spacecraft industry for their insulating properties, mechanical durability, light weight, and chemical resistance to radiation. Still PI materials remain exposed to a combination of high-energy electrons, protons, and ultraviolet (UV) photons, particles primarily responsible for radiation-induced damage in geosynchronous Earth orbit (GEO), which drastically change PI’s properties. This work reviews the effect of electron, proton, and UV photon irradiation on the material properties (morphology, absorption, mechanical properties, and charge transport) of PI. The different damaging mechanisms and chemical consequences that drive changes in the material properties of PI caused by each individual kind of irradiation will be discussed in detail. Full article
(This article belongs to the Special Issue Advances in Polyimide Films: Preparation, Properties and Applications)
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