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Physics and Mechanics of New Materials and Their Applications 2023

A special issue of Applied Sciences (ISSN 2076-3417). This special issue belongs to the section "Materials Science and Engineering".

Deadline for manuscript submissions: closed (10 October 2023) | Viewed by 2084

Special Issue Editors


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Guest Editor
I. I. Vorovich Mathematics, Mechanics, and Computer Science Institute, Southern Federal University, 344090 Rostov-on-Don, Russia
Interests: mechanical engineering; solid state physics; materials physics; materials science; superconductors; piezoceramics; piezoelectric ceramics; superconductivity; microstructure
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Guest Editor
Department of Industrial Engineering, Universitas 17 Agustus 1945 Surabaya, Surabaya 60118, Indonesia
Interests: industrial engineering; multi criteria decision making; operation research; operation management; production planning control

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Guest Editor
Department of Microelectronic Engineering, National Kaohsiung University of Science and Technology, Kaohsiung 807, Taiwan
Interests: signal processing; electrical engineering; signal analysis; time–frequency analysis; transducers; ultrasonics; piezoelectricity; array signal processing; adaptive beamforming
Special Issues, Collections and Topics in MDPI journals

Special Issue Information

Dear Colleagues,

To boost the development of modern technologies, the better performance of broad spectrum devices, research methods and computational approaches are prerequisite. To enhance the function and performance of the devices, the physics and mechanics investigation of related materials, composites, and applications is critical. The present Special Issue aims to explore new trends in these scientific and technical areas. A certain number of contributions for this Special Issue will come from selected papers of PHENMA 2023, the 11th International Conference on "Physics and Mechanics of New Materials and Their Applications" (PHENMA 2023),

4–7 October, 2023, http://phenma2023.sfedu.ru/

Topics of interest (among others) include:

Materials: ferro-piezoelectrics, semiconductors, superconductors, environmental materials, composite, ceramics, thin films, nanomaterials, advanced materials for additive manufacturing, metal engineering materials, functionally graded materials, etc.

Synthesis and Processing: powder processing, processing technologies, piezoelectric technologies, MEMS-processing, etc.

Characterization and Research Methods: material design, microstructure properties, chemical properties, physical properties, mechanical properties, strength properties, finite-element modeling, mathematical modeling, physical modeling, physical experiment, etc.

Applications: MEMS, hetero-structures, piezotransducers, energy harvesting, superconductive devices, light-emitting diodes, multimedia communication, fiber-reinforced composites, construction health monitoring, lubricant and tribology, etc.

Underwater Technologies: underwater communication, marine engineering, power system, ocean energy, etc.

Biomedical Engineering: medical materials, nanotechnology in medicine, medical instrumentation, physical methods in medicine, waste, biological product processing, etc.

Industry and Management: CAD/CAM/CAE application, industrial instruments, EDM, materials machining, machines, design and building constructions, etc.

Prof. Dr. Ivan A. Parinov
Dr. Erni Puspanantasari Putri
Prof. Dr. Shun-Hsyung Chang
Dr. Hung-Yu Wang
Guest Editors

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Applied Sciences is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2400 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • materials
  • processing
  • chemistry
  • physics
  • mechanics
  • theory
  • experiment
  • modeling
  • applications
  • industry

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Published Papers (1 paper)

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Research

12 pages, 5233 KiB  
Article
The Catalytic Curing Reaction and Mechanical Properties of a New Composite Resin Matrix Material for Rocket Fuel Storage Tanks
by Chuan Li, Zhengjun Liu, Ke Xue, Yingda Huo, Fubao Li and Xiaoping Zhu
Appl. Sci. 2023, 13(21), 11790; https://doi.org/10.3390/app132111790 - 28 Oct 2023
Cited by 1 | Viewed by 1257
Abstract
In this paper, an equimolar blend of bisphenol A dipropargyl ether and cyanate ester was selected to study the effect of different catalysts on the curing reaction of a bisphenol A dipropargyl ether and cyanate ester blended resin system, and the thermal stability [...] Read more.
In this paper, an equimolar blend of bisphenol A dipropargyl ether and cyanate ester was selected to study the effect of different catalysts on the curing reaction of a bisphenol A dipropargyl ether and cyanate ester blended resin system, and the thermal stability and mechanical properties of the catalytically cured blended resin system were investigated. Acetylacetone salts of transition metals and dibutyl ditin laurate reduced the curing temperature of bisphenol AF-type di cyanate ester, and copper acetylacetonate at a mass fraction of 0.3% significantly reduced the curing temperature of bisphenol AF-type di cyanate ester to less than 473 K. Bisphenol A dipropargyl ether pr-polymerized and equimolarly blended with bisphenol A di cyanate ester and bisphenol E-type di cyanate ester also cured below 473 K under the same conditions. Among the cured compounds of the blended resins of bisphenol A dipropargyl ether with bisphenol AF-type di cyanate ester, bisphenol A-type di cyanate ester and bisphenol E-type di cyanate ester, the blended resins of bisphenol A-type di cyanate ester and bisphenol E-type di cyanate ester have better overall performance. The residual rate of 873 K in air was 38%, and the flexural strength, flexural modulus, and impact strength were 129.4 MPa, 4.3 GPa, and 27.3 kJ·m−2, respectively. This kind of blended resin is expected to be used in the liquid oxygen storage tanks of rockets. Full article
(This article belongs to the Special Issue Physics and Mechanics of New Materials and Their Applications 2023)
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