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Electromagnetic Interference and Compatibility, Volume III
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Electromagnetic Interference and Compatibility, Volume III

A special issue of Electronics (ISSN 2079-9292). This special issue belongs to the section "Microwave and Wireless Communications".

Deadline for manuscript submissions: closed (31 December 2023) | Viewed by 8994

Special Issue Editor

Dr. Paolo Stefano Crovetti

E-Mail Website1 Website2
Guest Editor
Department of Electronics and Telecommunications, Politecnico di Torino, 10129 Turin, Italy
Interests: analog and mixed signal circuits; ultra-low-power integrated circuits design; digital-to-analog converter
Special Issues, Collections and Topics in MDPI journals

Special Issue Information

Dear Colleagues,

Emerging Internet of Things (IoT), smart grid, and transport electrification applications, along with the advances of semiconductor technology that enables faster switching devices for highly efficient power conversion, are bringing about new EMC challenges that need to be addressed through the whole design flow of electric and electronic systems, starting from the highest levels of abstraction down to the physical level.

The coexistence of ultra-low-voltage IoT nodes and safety-critical sensors close to power converters and drives in smart grids and electric vehicles, in particular, is raising new EMC concerns which demand novel concepts and methodologies in EMC modeling, design, simulation, optimization, and measurement, both at the system and at the integrated circuit level. Moreover, a strong multidisciplinary approach is currently needed to gain insight into increasingly complex phenomena and interference scenarios.

On the other hand, emerging artificial intelligence (AI) and machine learning (ML) techniques provide new tools to EMC designers, whose potential is still to be explored.

In this Special Issue, we encourage contributions addressing electromagnetic compatibility and interference topics in the broadest sense, including but not limited to IC- and system-level immunity and susceptibility issues of information and communications technology (ICT) and power electronic systems, either in emerging IoT, smart grid, and electric vehicles applications or in more traditional systems, EMC-oriented simulation and measurement techniques, as well as EMC applications of ML and AI.

Dr. Paolo Stefano Crovetti
Guest Editor

Manuscript Submission Information

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Published Papers (5 papers)

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Research

12 pages, 5238 KiB  
Communication
Experimental Investigation of the Metasurfaced Reverberation Chamber
by Hengyi Sun, Zhuo Li, Changqing Gu, Qian Xu, Yaoran Zhang, Zhengran Xu, Xiaoping Luo, Changjiang Sun and Alfred Chan
Electronics 2023, 12(24), 4985; https://doi.org/10.3390/electronics12244985 - 12 Dec 2023
Viewed by 1079
Abstract
This paper explores the concept of a metasurfaced reverberation chamber (MRC) through empirical measurements, utilizing a 1-bit random coding metasurfaced stirrer within a standard reverberation chamber (RC). The study rigorously compares the performance of the MRC against traditional mechanical stirrers, both horizontal and [...] Read more.
This paper explores the concept of a metasurfaced reverberation chamber (MRC) through empirical measurements, utilizing a 1-bit random coding metasurfaced stirrer within a standard reverberation chamber (RC). The study rigorously compares the performance of the MRC against traditional mechanical stirrers, both horizontal and vertical, in terms of key metrics. These metrics include the quality factor (Q factor), number of samples, standard deviation, angle autocorrelation, average K factor, total scattering cross section (TSCS), and the enhanced back scattering coefficient (eb). The results demonstrate the practicality and effectiveness of the MRC in the operational frequency range of the RC. Notably, the use of the 1-bit random coding metasurface stirrer shows potential in significantly expanding the test volume of the RC, marking a promising advancement in reverberation chamber technology. Full article
(This article belongs to the Special Issue Electromagnetic Interference and Compatibility, Volume III)
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17 pages, 18286 KiB  
Article
Safety Assessment for Full Flight between Beidou Radio Determination Satellite Service Airborne Equipment and 5G System
by Wantong Chen, Yuyin Tian, Shuguang Sun and Ruihua Liu
Electronics 2023, 12(15), 3350; https://doi.org/10.3390/electronics12153350 - 4 Aug 2023
Cited by 1 | Viewed by 1355
Abstract
The Beidou Radio Determination Satellite Service (RDSS) is an advantageous service of the Beidou system. However, due to the weak landing power of Beidou RDSS signals and an operating frequency close to the 5G frequency, the system is vulnerable to interference from ground [...] Read more.
The Beidou Radio Determination Satellite Service (RDSS) is an advantageous service of the Beidou system. However, due to the weak landing power of Beidou RDSS signals and an operating frequency close to the 5G frequency, the system is vulnerable to interference from ground signals. In this paper, from the perspective of civil aviation safety, different evaluation indicators are used for the takeoff and cruise phases, respectively, to study the impact caused by adjacent frequency interference on airborne Beidou RDSS equipment. In the takeoff phase, accurate aircraft position information is obtained by processing real trajectory files. Deterministic analysis methods are used to determine the safety distance for the coexistence of the two systems. During the cruise phase, ground-based 5G base stations have less influence on the airborne RDSS receiver due to the high flight altitude, so the main consideration is electromagnetic compatibility between the airborne Beidou RDSS system and the 5G ATG system. By establishing a Boeing 737–800 simulation model, the antenna isolation degree is used as the evaluation index, and a reasonable antenna layout is given according to the evaluation results. In this study, the theoretical simulation and real flight data are combined to summarise the exact range of adjacent frequency influence during the takeoff phase and a reasonable antenna layout during the cruise phase. Full article
(This article belongs to the Special Issue Electromagnetic Interference and Compatibility, Volume III)
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15 pages, 5925 KiB  
Article
Analytical and 3D Numerical Study of Multilayer Shielding Effectiveness for Board Level Shielding Optimization
by Roman Leduc, Njomza Ibrahimi, Jean-Marc Dienot, Veronika Gavrilenko and Robert Ruscassié
Electronics 2022, 11(24), 4156; https://doi.org/10.3390/electronics11244156 - 13 Dec 2022
Cited by 1 | Viewed by 1859
Abstract
The strong development of solid-state power sources offers numerous benefits (such as higher operating frequencies and reduced switching times and power losses), but contributes inherently to the extended range of electromagnetic interferences (EMI). As these systems are associated with a set of embedded [...] Read more.
The strong development of solid-state power sources offers numerous benefits (such as higher operating frequencies and reduced switching times and power losses), but contributes inherently to the extended range of electromagnetic interferences (EMI). As these systems are associated with a set of embedded monitoring devices using low amplitude signals, it becomes necessary to consider new critical cases of electromagnetic (EM) immunity correlated to such environments. The most common solution against aggressive radiated EMI is the metallic enclosure, which brings a strong shielding effectiveness (SE), but is it always the best compromise? Our study in this paper is focused on the SE of multilayer designs and is therefore intended to optimize the enclosures’ compactness for board level shielding (BLS) on printed circuit boards (PCB). First, results are presented, based on metallic multilayer shielding theory and parametric numerical studies in the intentional electromagnetic interferences (IEMI) frequency range, from 0.2 to 5 GHz. Then, a complete 3D EM co-simulation model using the microwave and design modules of CST Studio Suite (which includes the subject, the EMI radiating source, and the multilayer shielding) is proposed, with emphasis on the pertinent choices regarding layers width and their arrangement for compact EM shielding and immunity optimization. Full article
(This article belongs to the Special Issue Electromagnetic Interference and Compatibility, Volume III)
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23 pages, 6772 KiB  
Article
EMC Impact of Disturbances Generated by Multiple Sources
by Hamidreza Karami, Marcos Rubinstein, Farhad Rachidi, Christophe Perrenoud, Emmanuel de Raemy, Pascal Kraehenbuehl and Arturo Mediano
Electronics 2022, 11(21), 3530; https://doi.org/10.3390/electronics11213530 - 29 Oct 2022
Cited by 3 | Viewed by 2126
Abstract
In this paper, the impact of an increasing number of arbitrary electrical/electronic devices on the overall radiated emissions is investigated. Understanding and quantifying such an impact are prerequisites to the proper evaluation of electromagnetic compatibility (EMC) of various electronic systems and devices and, [...] Read more.
In this paper, the impact of an increasing number of arbitrary electrical/electronic devices on the overall radiated emissions is investigated. Understanding and quantifying such an impact are prerequisites to the proper evaluation of electromagnetic compatibility (EMC) of various electronic systems and devices and, if needed, to revisiting the international standards. To evaluate the radiated emissions from multiple electronic devices, each arbitrary electronic device is characterized using an equivalent Huygens’s surface, in which the tangential components of electric and magnetic near fields are calculated (or measured). The radiated emission from the arbitrary electronic device can be calculated using the electric and magnetic near fields for an arbitrary phase (correlated or uncorrelated), position, and orientation. The influence of several parameters affecting the radiated emissions from multiple arbitrary electronic devices, including the number of disturbance sources, the polarization of each device, the radiation pattern of each device, the location and orientation of each device, and the phase shifts between devices, are analyzed. The numerical results show that the mentioned parameters have a significant effect on the radiated emissions, and cannot be neglected in EMC considerations. In general, increasing the number of electronic devices leads to an increase in the level of radiated emissions. However, the increase depends on other parameters such as the arrangement (the radiation pattern for each device, the distance between the devices, and the orientation and/or polarization of each device). The proposed method can be straightforwardly applied to devices characterized by near-field measurements or multimodular large equipment with long cables. Full article
(This article belongs to the Special Issue Electromagnetic Interference and Compatibility, Volume III)
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16 pages, 8615 KiB  
Article
A Novel IC-Stripline Cell Design Based on Image Theory
by Ledong Chen, Jianfei Wu, Yifei Zheng, Hongyi Wang and Liming Zheng
Electronics 2022, 11(17), 2640; https://doi.org/10.3390/electronics11172640 - 23 Aug 2022
Cited by 1 | Viewed by 1552
Abstract
With the purpose of radiation emissions and immunity measurement of large size and high-frequency integrated circuits (ICs), three closed version IC-Stripline cells conforming to the IEC standardswere designed in this paper to expand the uniform field region and the working frequency band of [...] Read more.
With the purpose of radiation emissions and immunity measurement of large size and high-frequency integrated circuits (ICs), three closed version IC-Stripline cells conforming to the IEC standardswere designed in this paper to expand the uniform field region and the working frequency band of the traditional IC-Stripline cell. In these cells, the long version IC-Stripline cell expands the 3 dB uniform field region of the traditional IC-Stripline cell from 3 × 3 cm to 3 × 8 cm, with the working bandwidth remaining as 6 GHz. The IC-Stripline cell based on image theory further expands the 3 dB uniform field region into two 3 × 8 cm areas with the working bandwidth unchanged. The third cell is a scaled-down IC-Stripline cell based on image theory, which can expand the working bandwidth from 6 GHz to 12 GHz and the total area of the uniform field region is equivalent to that of the traditional IC-Stripline cell. Full article
(This article belongs to the Special Issue Electromagnetic Interference and Compatibility, Volume III)
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