Digital Twins in Industries and Beyond
A special issue of Future Internet (ISSN 1999-5903). This special issue belongs to the section "Techno-Social Smart Systems".
Deadline for manuscript submissions: closed (20 February 2024) | Viewed by 1345
Special Issue Editors
Interests: augmented reality; digital twins; advanced manufacturing
Special Issues, Collections and Topics in MDPI journals
Interests: manufacturing; augmented reality in manufacturing; product design; sustainable manufacturing
Special Issues, Collections and Topics in MDPI journals
Special Issue Information
Dear Colleagues,
There have been significant developments in digital twin technologies in the last decade. This volume intends to cover the nonengineering applications of DT, such as those recently applied in defense, healthcare, arts, skills transfer, and learning, as well as other socio-economic utilizations of DT technology. Integrations of DT with other technologies, such as VR/AR, finite element analysis, cloud and edge platforms, microservice, etc., are most welcome as they complement DT technologies well.
This Special Issue is soliciting conceptual, theoretical, and experimental contributions, in addition to discussing and treating challenges and solutions to a set of currently unresolved key challenges. Please note that all submissions should fit the primary scope of Future Internet.
Prof. Dr. Soh Khim Ong
Prof. Dr. Andrew Yeh Ching Nee
Guest Editors
Manuscript Submission Information
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Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Future Internet is an international peer-reviewed open access monthly journal published by MDPI.
Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 1600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.
Keywords
- digital twins
- technologies integration
- learning digital twins
- defense
- healthcare
- learning and education
- industrial applications
- socioeconomic digital twin applications
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