Numerical Simulation and Experimental Studies of Wave Phenomena in Composite Materials
A special issue of Materials (ISSN 1996-1944). This special issue belongs to the section "Materials Simulation and Design".
Deadline for manuscript submissions: closed (20 January 2022) | Viewed by 5727
Special Issue Editors
Interests: applied mathematics; numerical analysis; computational mechanics; wave propagation; mechanics of solids; machine learning methods; non-destructive evaluation; structural health monitoring; acoustic metamaterials
Special Issues, Collections and Topics in MDPI journals
Interests: applied mathematics; numerical analysis and computational mechanics; wave dynamics; BEM technique; computer modelling (FORTRAN, MATLAB); simulation of ultrasonic wave phenomena; experimental techniques for elastic guided waves; wave-based non-destructive testing and structural health monitoring
Special Issues, Collections and Topics in MDPI journals
Special Issue Information
Dear Colleagues,
It is our pleasure to invite you to submit a manuscript to the forthcoming Special Issue “Numerical Simulation and Experimental Studies of Wave Phenomena in Composite Materials” in Materials.
At present, composite materials and smart structures exhibiting enhanced properties are used extensively in numerous engineering applications, such as aerospace and wind energy industries, civil construction, etc. Investigation of ultrasonic wave phenomena in complex composite structures is among the topical problems in the mechanics of composites, with a variety of applications. In large part, this relates to the fundamentals of wave-based nondestructive evaluation and structural health monitoring aiming at early-stage damage detection and material condition evaluation. Another up-to-date topic being inspired by complex wave phenomena in inhomogeneous waveguides is the design of a novel class of composite materials, the so-called phononic crystals and acoustic metamaterials, which provide unusual elastodynamic properties and allow manipulating ultrasonic wave propagation. For these and for many other cases, studies of dynamic behavior of complex three-dimensional composite materials remain a topical issue.
As a prime step in understanding and analysis of complex wave phenomena in smart composite materials, efficient and accurate mathematical models and numerical simulation tools are required which are suitable for fast parametric studies at the development stage or for the implementation in real electromechanical devices and systems. In particular, they should take into account peculiarities of material microstructures, coupled mechanical and electrical fields, complex shapes of sensors and transducers, as well as wave scattering by localized or distributed inhomogeneities. Such simulation problems are often very complex and cannot be treated efficiently with simple analytical or conventional numerical tools, inspiring, therefore, the development of advanced computational methods for 3D wave dynamic problems.
Another challenging aspect of wave phenomenon studies relates to experimental techniques for wave excitation, detection, and visualization in complex composite and smart structures. Their advancement is important for the adjustment of the developed simulation models, verification of theoretical results, and enhancement of our understanding of wave-related physics.
It is our pleasure to invite you to submit a manuscript for this Special Issue related to experimental and numerical studies of wave phenomena in composite materials. Full papers, short communications, and reviews are all welcome.
Dr. Mikhail V. Golub
Dr. Artem A. Eremin
Guest Editors
Manuscript Submission Information
Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.
Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Materials is an international peer-reviewed open access semimonthly journal published by MDPI.
Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.
Keywords
- Composites
- Simulation
- Numerical analysis
- Wave propagation
- Computational mechanics
- Elastic/acoustic metamaterials and phononic crystals
- Experimental studies
- Structural health monitoring
- Nondestructive evaluation
Benefits of Publishing in a Special Issue
- Ease of navigation: Grouping papers by topic helps scholars navigate broad scope journals more efficiently.
- Greater discoverability: Special Issues support the reach and impact of scientific research. Articles in Special Issues are more discoverable and cited more frequently.
- Expansion of research network: Special Issues facilitate connections among authors, fostering scientific collaborations.
- External promotion: Articles in Special Issues are often promoted through the journal's social media, increasing their visibility.
- e-Book format: Special Issues with more than 10 articles can be published as dedicated e-books, ensuring wide and rapid dissemination.
Further information on MDPI's Special Issue polices can be found here.