Atomic Layer Deposition: From Thin Films to Nanostructured Materials
A special issue of Materials (ISSN 1996-1944). This special issue belongs to the section "Thin Films and Interfaces".
Deadline for manuscript submissions: closed (20 February 2024) | Viewed by 6350
Special Issue Editor
Interests: atomic layer deposition; photocatalysis; electrospinning; nanomaterials; sensors; thin films
Special Issues, Collections and Topics in MDPI journals
Special Issue Information
Dear Colleagues,
Atomic layer deposition (ALD) is an ultrathin film deposition method. This technique allows the deposition of various materials (oxides, nitrides, metals, etc.) with a thickness control at the nanometric scale, as well as excellent uniformity and conformality.
The aim of this Special Issue is to assemble high-quality contributions on the deposition of thin films as well as the synthesis and modification of nanostructures using ALD. It will deal with the design of new thin films and nanostructures by tuning their morphology, geometry, crystallinity, and interfaces. The relation between these parameters and the physical–chemical properties will also be investigated. New applications in different fields, such as health, the environment, renewable energy, microelectronics, etc., will be also explored.
Relevant contributions related to prospective materials’ design, original materials’ properties, and innovative characterization techniques will also be considered.
Dr. Mikhael Bechelany
Guest Editor
Manuscript Submission Information
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Keywords
- thin film
- nanomaterial
- interface
- nanostructured material
- porous materials
- energy
- health
- environment
- membrane
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