Feature Papers in Thin Films and Interfaces
A special issue of Materials (ISSN 1996-1944). This special issue belongs to the section "Thin Films and Interfaces".
Deadline for manuscript submissions: closed (20 August 2023) | Viewed by 15875
Special Issue Editors
Interests: thin films; optical properties; spectroscopic ellipsometry; photovoltaics
Special Issues, Collections and Topics in MDPI journals
Interests: soft matter theory; self-assembly theory; theory of colloidal forces; computer simulations
Special Issues, Collections and Topics in MDPI journals
Special Issue Information
Dear Colleagues,
Thin film properties and material behaviors at interfaces may differ substantially from their bulk form, these differences enabling an incredibly expanding range of technological applications, from electronics to medicine. The unique structural, chemical, electrical, optical, magnetic, and mechanical properties of thin films compared to their bulk counterparts arise from the compositional and structural design, interactions with other materials or ambient, defects, and other characteristics. Similarly, the nature of thin films often involves complicated interactions between materials at interfaces utilized to manipulate chemical reactions, diffusion, self-assembly, and other physical processes, their fundamental understanding, characterization, and application continuously advancing. It is my pleasure to invite you to submit a manuscript for our Special Issue “Feature Papers in Thin Films and Interfaces”, with topics including, but not limited to, thin film deposition and processing, advanced characterization techniques, fundamental properties of materials and systems, computational studies, and emerging applications, full papers, communications, and reviews being welcome.
Prof. Dr. Nikolas J. Podraza
Prof. Dr. Jordi Faraudo
Prof. Dr. Dameng Liu
Guest Editors
Manuscript Submission Information
Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.
Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Materials is an international peer-reviewed open access semimonthly journal published by MDPI.
Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.
Keywords
- vacuum and solution deposition methods
- self-assembly
- chemical absorption
- side effects
- quantum confinement
- engineered materials
- functional coatings
- photovoltaics
- sensors
- hard coatings
- SIMS
- XPS
- spectroscopic ellipsometry
- electron microscopy
- computational modeling
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