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Metals
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Magnetization Process of Bulk and Classical Amorphous Alloys
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Magnetization Process of Bulk and Classical Amorphous Alloys

A special issue of Metals (ISSN 2075-4701).

Deadline for manuscript submissions: closed (31 July 2021) | Viewed by 8865

Special Issue Editor

Prof. Marcin Nabiałek

E-Mail Website
Guest Editor
Department of Physics, Faculty of Production Engineering and Materials Technology, Częstochowa University of Technology, Czestochowa, Poland
Interests: amorphous materials; nanoscience; properties; magnetism; titanium alloys; biomaterials; polymers; geopolymers; composites; method of production supercooled materials; foundry engineering; new technology; nanomaterials; annealing methods; materials science; physics; chemical engineering; engineering
Special Issues, Collections and Topics in MDPI journals

Special Issue Information

Dear Colleagues,

This Special Edition of Metals, titled “Magnetization Process of Bulk and Classical Amorphous Alloys” will be concentrated around a new group of magnetic materials under the heading of “Bulk Amorphous Materials”. These unusual materials are characterized by unique properties, in comparison to their crystalline counterparts (given the same chemical composition). The potential applications are extensive for this type of alloy, and they are utilized in many branches of technology and science. In addition, these materials could be called “ecological” and “economical”. Magnetic materials are widely used in electrical, electronic, and electrotechnical equipment. The important parameters that determine their suitability are core losses, saturation magnetization, and/or magnetic permeability. However, another important magnetic phenomenon—magnetostriction—should not be omitted from this list. In the case of traditional metal laminations of Fe–Si, magnetostriction is the cause of excessive noise and increased operating temperature of transformers. The magnetization process in amorphous materials relates to the presence of structural defects, in the form of point and linear defects. The influence of these defects on the magnetization process has been well described by Prof. H. Kronmüller.

For an amorphous material to be classified as “bulk”, its sample thickness is required to be greater than 100 µm.

The present volume has the objective of presenting the latest achievements and inventions, as well as the newest methods of production, relating to bulk amorphous materials with magnetic properties. These materials have promising potential applications and can substantially affect the protection of the environment and its natural resources, as well as the economics of use. Appropriate design of the magnetization process, through the application of thermal treatment, could substantially influence the performance parameters. Analysis of the initial magnetization curves, according to the Kronmüller theorem, reveals the possibility of determining changes in the number of structural defects in the volume of the investigated samples; i.e., modeling the performance parameters. Moreover, these materials can find applications in military industries, sports industries, or medicine.

Prof. Marcin Nabiałek
Guest Editor

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Metals is an international peer-reviewed open access monthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • bulk amorphous alloys
  • defects in amorphous alloys
  • structure
  • magnetic properties
  • application of ferromagnetic amorphous alloys
  • magnetization process
  • H. Kronmüller theory
  • core losses
  • saturation

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Published Papers (3 papers)

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Research

21 pages, 7685 KiB  
Article
Investigations of Infrared Desktop Reflow Oven with FPCB Substrate during Reflow Soldering Process
by Muhammad Iqbal Ahmad, Mohd Sharizal Abdul Aziz, Mohd Zulkifly Abdullah, Mohd Arif Anuar Mohd Salleh, Mohammad Hafifi Hafiz Ishak, Wan Rahiman and Marcin Nabiałek
Metals 2021, 11(8), 1155; https://doi.org/10.3390/met11081155 - 21 Jul 2021
Cited by 13 | Viewed by 3552
Abstract
This paper presents the study of infrared (IR) reflow oven characteristics for suitable operating conditions of the flexible printed circuit board (FPCB) in the reflow soldering process. A computer-based model that imitates a real-time oven was developed with practical boundary conditions. Since the [...] Read more.
This paper presents the study of infrared (IR) reflow oven characteristics for suitable operating conditions of the flexible printed circuit board (FPCB) in the reflow soldering process. A computer-based model that imitates a real-time oven was developed with practical boundary conditions. Since the radiation effect is dominant in the reflow process, a discrete ordinate (DO) model was selected to simulate the effect. The experimental work acts as a benchmark and the reflow profile was set to follow the standards of JSTD-020E. The simulation of the model has a great consensus between the experimental data. It was found that the temperature distribution was inhomogeneous along with the phases. The FPCB surface also has a higher surface temperature than oven air during the operating reflow profile. An in-depth study using the simulation approach reveals that the temperature distribution of the desktop reflow oven is dependent on several factors, namely fan speed, FPCB position, and FPCB thickness. The rotational fan generates an unsteady flow that induces inhomogeneous temperature at different positions in the reflow oven cavity. The results are useful for studying further improvements to achieve temperature uniformity within the oven chamber. Full article
(This article belongs to the Special Issue Magnetization Process of Bulk and Classical Amorphous Alloys)
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16 pages, 3028 KiB  
Article
Nonisothermal Kinetic Degradation of Hybrid CNT/Alumina Epoxy Nanocomposites
by Muhammad Helmi Abdul Kudus, Muhammad Razlan Zakaria, Mohd Firdaus Omar, Muhammad Bisyrul Hafi Othman, Hazizan Md. Akil, Marcin Nabiałek, Bartłomiej Jeż and Mohd Mustafa Al Bakri Abdullah
Metals 2021, 11(4), 657; https://doi.org/10.3390/met11040657 - 17 Apr 2021
Cited by 6 | Viewed by 2011
Abstract
Due to the synergistic effect that occurs between CNTs and alumina, CNT/alumina hybrid-filled epoxy nanocomposites show significant enhancements in tensile properties, flexural properties, and thermal conductivity. This study is an extension of previously reported investigations into CNT/alumina epoxy nanocomposites. A series of epoxy [...] Read more.
Due to the synergistic effect that occurs between CNTs and alumina, CNT/alumina hybrid-filled epoxy nanocomposites show significant enhancements in tensile properties, flexural properties, and thermal conductivity. This study is an extension of previously reported investigations into CNT/alumina epoxy nanocomposites. A series of epoxy composites with different CNT/alumina loadings were investigated with regard to their thermal-degradation kinetics and lifetime prediction. The thermal-degradation parameters were acquired via thermogravimetric analysis (TGA) in a nitrogen atmosphere. The degradation activation energy was determined using the Flynn–Wall–Ozawa (F-W-O) method for the chosen apparent activation energy. The Ea showed significant differences at α > 0.6, which indicate the role played by the CNT/alumina hybrid filler loading in the degradation behavior. From the calculations, the lifetime prediction at 5% mass loss decreased with an increase in the temperature service of nitrogen. The increase in the CNT/alumina hybrid loading revealed its contribution towards thermal degradation and stability. On average, a higher Ea was attributed to greater loadings of the CNT/alumina hybrid in the composites. Full article
(This article belongs to the Special Issue Magnetization Process of Bulk and Classical Amorphous Alloys)
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18 pages, 7486 KiB  
Article
The Effect of Thermal Annealing on the Microstructure and Mechanical Properties of Sn-0.7Cu-xZn Solder Joint
by Mohd Izrul Izwan Ramli, Mohd Arif Anuar Mohd Salleh, Rita Mohd Said, Mohd Mustafa Al Bakri Abdullah, Dewi Suriyani Che Halin, Norainiza Saud and Marcin Nabiałek
Metals 2021, 11(3), 380; https://doi.org/10.3390/met11030380 - 25 Feb 2021
Cited by 1 | Viewed by 2641
Abstract
The microstructural properties of a Pb-free solder joint significantly affect its mechanical behaviours. This paper details a systematic study of the effect of the annealing process on the microstructure and shear strength of a Zn-added Sn-0.7Cu solder joint. The results indicated that the [...] Read more.
The microstructural properties of a Pb-free solder joint significantly affect its mechanical behaviours. This paper details a systematic study of the effect of the annealing process on the microstructure and shear strength of a Zn-added Sn-0.7Cu solder joint. The results indicated that the IMC layer’s thickness at the solder/Cu interface increases with annealing time. The interfacial IMC layer of the Sn-0.7Cu solder joint gradually thickened with increasing annealing time and annealing temperature, while the interfacial IMC layer’s morphology changed from scallop-type to layer-type after the annealing process. However, the addition of 1.0 wt.% and 1.5 wt.% Zn in the Sn-0.7Cu effectively altered the interfacial IMC phase to Cu-Zn and suppressed the growth of Cu3Sn during the annealing process. The single-lap shear tests results confirmed that the addition of Zn decreased the shear strength of Sn-0.7Cu. The interfacial IMC of the Cu6Sn5 phase in Sn-0.7Cu changed to Cu-Zn due to the addition of Zn. The shear fractures in the annealed solder joint were ductile within the bulk solder instead of the interfacial IMC layer. Increased annealing time resulted in the increased presence of the Cu-Zn phase, which decreased the hardness and shear strength of the Sn-0.7Cu solder joint. Full article
(This article belongs to the Special Issue Magnetization Process of Bulk and Classical Amorphous Alloys)
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