Semiconductor and Energy Materials and Processing Technology

A special issue of Micromachines (ISSN 2072-666X). This special issue belongs to the section "D:Materials and Processing".

Deadline for manuscript submissions: 31 March 2025 | Viewed by 66

Special Issue Editor


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Guest Editor
School of Integrative Engineering, Chung-Ang University, Seoul 06974, Republic of Korea
Interests: new materials; processing and design; integrated systems; 3D integration; semiconductor materials; process and integration; battery and energy materials; microstructural evolution; characterization
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Special Issue Information

Dear Colleagues,

Semiconductor and energy materials and processing technology are widely employed in optical devices, electronic devices, sensors, energy, displays, and semiconductors. These semiconductor and energy materials are deposited using metals, ceramics, dielectrics, carbon materials, composites, and hybrid materials, and are widely utilized in the electronics industry, such as in the semiconductors mentioned above. In addition, these semiconductor processing technologies comprise various processes such as PVD (Physically Vapor Deposition), CVD (Chemically Vapor Deposition), ALD (Atomic Layer Deposition), sol–gel processing, electroplating, and electroless plating. The development of high-performance optics, energy, sensors, displays, and semiconductors requires the development of new thin film materials and processes. Therefore, this Special Issue aims to provide an overview of materials and processing technologies that can be employed in various new devices.

The scope of this Special Issue includes, but is not limited to, the following topics:

  • Semiconductor processing technology;
  • Semiconductor materials;
  • Thin film processing;
  • Sensor materials and processing;
  • Optical and electronics materials;
  • Energy materials and processing.

Prof. Dr. Sung Gyu Pyo
Guest Editor

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Micromachines is an international peer-reviewed open access monthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • semiconductor processing
  • etch process
  • interconnect technology
  • thin film processing
  • battery materials
  • process integration
  • image sensor
  • energy materials and processing

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Published Papers

This special issue is now open for submission.
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