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Micromachines
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Physical Microelectromechanical Systems (MEMS): Design, Modeling, Fabrication, and Characterization
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Physical Microelectromechanical Systems (MEMS): Design, Modeling, Fabrication, and Characterization

A special issue of Micromachines (ISSN 2072-666X). This special issue belongs to the section "A：Physics".

Deadline for manuscript submissions: closed (31 July 2021) | Viewed by 14534

Special Issue Editor

Dr. Joshua En-yuan Lee

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Guest Editor
Insitute of Microelectronics (IME), Agency for Science Technology and Research (A*STAR), Singapore, Singapore
Interests: Microelectromechanical Systems (MEMS); micromechanical resonators; micromechanical sensors; piezoelectric devices

Special Issue Information

Dear Colleagues,

We will soon be celebrating 60 years of microelectromechanical systems (MEMS) since Nathanson’s demonstration of the resonant gate transistor. Looking back, the field of MEMS has grown immensely, seeing commercialization in the 1980s, and widespread adoption and proliferation of sensors in the age of the Internet of Things in the past decade. The field has also seen rapid divergence, with penetration into a wide range of fields. This Special Issue seeks to focus on physical MEMS, inviting reviews and original results on MEMS sensors and MEMS actuators. We also welcome articles reporting novel applications of MEMS given trends that require going beyond devices to system integration. Of interest are reviews and new results on MEMS packaging techniques and challenges. We also invite articles on materials developments for MEMS as well as studies on MEMS reliability.

Dr. Joshua En-yuan Lee
Guest Editor

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Micromachines is an international peer-reviewed open access monthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • MEMS sensors
  • MEMS actuators
  • MEMS applications
  • MEMS packaging
  • advances in materials for MEMS
  • MEMS reliability

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Published Papers (5 papers)

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Research

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12 pages, 3903 KiB  
Article
Python-Based Open-Source Electro-Mechanical Co-Optimization System for MEMS Inertial Sensors
by Rui Amendoeira Esteves, Chen Wang and Michael Kraft
Micromachines 2022, 13(1), 1; https://doi.org/10.3390/mi13010001 - 21 Dec 2021
Cited by 3 | Viewed by 3821
Abstract
The surge in fabrication techniques for micro- and nanodevices gave room to rapid growth in these technologies and a never-ending range of possible applications emerged. These new products significantly improve human life, however, the evolution in the design, simulation and optimization process of [...] Read more.
The surge in fabrication techniques for micro- and nanodevices gave room to rapid growth in these technologies and a never-ending range of possible applications emerged. These new products significantly improve human life, however, the evolution in the design, simulation and optimization process of said products did not observe a similarly rapid growth. It became thus clear that the performance of micro- and nanodevices would benefit from significant improvements in this area. This work presents a novel methodology for electro-mechanical co-optimization of micro-electromechanical systems (MEMS) inertial sensors. The developed software tool comprises geometry design, finite element method (FEM) analysis, damping calculation, electronic domain simulation, and a genetic algorithm (GA) optimization process. It allows for a facilitated system-level MEMS design flow, in which electrical and mechanical domains communicate with each other to achieve an optimized system performance. To demonstrate the efficacy of the methodology, an open-loop capacitive MEMS accelerometer and an open-loop Coriolis vibratory MEMS gyroscope were simulated and optimized—these devices saw a sensitivity improvement of 193.77% and 420.9%, respectively, in comparison to their original state. Full article
(This article belongs to the Special Issue Physical Microelectromechanical Systems (MEMS): Design, Modeling, Fabrication, and Characterization)
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13 pages, 4210 KiB  
Article
Low-Voltage and High-Reliability RF MEMS Switch with Combined Electrothermal and Electrostatic Actuation
by Yong Zhu and Jitendra Pal
Micromachines 2021, 12(10), 1237; https://doi.org/10.3390/mi12101237 - 12 Oct 2021
Cited by 12 | Viewed by 3249
Abstract
In this paper, we report a novel laterally actuated Radio Frequency (RF) Microelectromechanical Systems (MEMS) switch, which is based on a combination of electrothermal actuation and electrostatic latching hold. The switch takes the advantages of both actuation mechanisms: large actuation force, low actuation [...] Read more.
In this paper, we report a novel laterally actuated Radio Frequency (RF) Microelectromechanical Systems (MEMS) switch, which is based on a combination of electrothermal actuation and electrostatic latching hold. The switch takes the advantages of both actuation mechanisms: large actuation force, low actuation voltage, and high reliability of the thermal actuation for initial movement; and low power consumption of the electrostatic actuation for holding the switch in position in ON state. The switch with an initial switch gap of 7 µm has an electrothermal actuation voltage of 7 V and an electrostatic holding voltage of 21 V. The switch achieves superior RF performances: the measured insertion loss is −0.73 dB at 6 GHz, whereas the isolation is −46 dB at 6 GHz. In addition, the switch shows high reliability and power handling capability: the switch can operate up to 10 million cycles without failure with 1 W power applied to its signal line. Full article
(This article belongs to the Special Issue Physical Microelectromechanical Systems (MEMS): Design, Modeling, Fabrication, and Characterization)
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10 pages, 1301 KiB  
Article
Three-Dimensional Finite Element Analysis and Characterization of Quasi-Surface Acoustic Wave Resonators
by Wen Chen, Linwei Zhang, Shangshu Yang, Wenhan Jia, Songsong Zhang, Yuandong Gu, Liang Lou and Guoqiang Wu
Micromachines 2021, 12(9), 1118; https://doi.org/10.3390/mi12091118 - 17 Sep 2021
Cited by 2 | Viewed by 2382
Abstract
In this work, three-dimensional finite element analysis (3D FEA) of quasi-surface acoustic wave (QSAW) resonators with high accuracy is reported. The QSAW resonators consist of simple molybdenum (Mo) interdigitated transducers (IDT) on solidly mounted stacked layers of AlN/Mo/Si. Different to the SAW resonators [...] Read more.
In this work, three-dimensional finite element analysis (3D FEA) of quasi-surface acoustic wave (QSAW) resonators with high accuracy is reported. The QSAW resonators consist of simple molybdenum (Mo) interdigitated transducers (IDT) on solidly mounted stacked layers of AlN/Mo/Si. Different to the SAW resonators operating in the piezoelectric substrates, the reported resonators are operating in the QSAW mode, since the IDT-excited Rayleigh waves not only propagate in the thin piezoelectric layer of AlN, but also penetrate the Si substrate. Compared with the commonly used two-dimensional (2D) FEA approach, the 3D FEA method reported in this work shows high accuracy, in terms of the resonant frequency, temperature coefficient of frequency (TCF), effective coupling coefficient (keff2) and frequency response. The fabricated QSAW resonator has demonstrated a keff2 of 0.291%, series resonant frequency of 422.50 MHz, and TCF of −23.418 ppm/°C in the temperature range between 30 °C and 150 °C, for the design of wavelength at 10.4 μm. The measurement results agree well with the simulations. Moreover, the QSAW resonators are more mechanically robust than lamb wave devices and can be integrated with silicon-based film bulk acoustic resonator (FBAR) devices to offer multi-frequency function in a single chip. Full article
(This article belongs to the Special Issue Physical Microelectromechanical Systems (MEMS): Design, Modeling, Fabrication, and Characterization)
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12 pages, 14954 KiB  
Article
Efficient Optomechanical Mode-Shape Mapping of Micromechanical Devices
by David Hoch, Kevin-Jeremy Haas, Leopold Moller, Timo Sommer, Pedro Soubelet, Jonathan J. Finley and Menno Poot
Micromachines 2021, 12(8), 880; https://doi.org/10.3390/mi12080880 - 27 Jul 2021
Cited by 2 | Viewed by 2833
Abstract
Visualizing eigenmodes is crucial in understanding the behavior of state-of-the-art micromechanical devices. We demonstrate a method to optically map multiple modes of mechanical structures simultaneously. The fast and robust method, based on a modified phase-lock loop, is demonstrated on a silicon nitride membrane [...] Read more.
Visualizing eigenmodes is crucial in understanding the behavior of state-of-the-art micromechanical devices. We demonstrate a method to optically map multiple modes of mechanical structures simultaneously. The fast and robust method, based on a modified phase-lock loop, is demonstrated on a silicon nitride membrane and shown to outperform three alternative approaches. Line traces and two-dimensional maps of different modes are acquired. The high quality data enables us to determine the weights of individual contributions in superpositions of degenerate modes. Full article
(This article belongs to the Special Issue Physical Microelectromechanical Systems (MEMS): Design, Modeling, Fabrication, and Characterization)
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Other

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1 pages, 631 KiB  
Erratum
Erratum: Zhu, Y.; Pal, J. Low-Voltage and High-Reliability RF MEMS Switch with Combined Electrothermal and Electrostatic Actuation. Micromachines 2021, 12, 1237
by Yong Zhu and Jitendra Pal
Micromachines 2021, 12(11), 1389; https://doi.org/10.3390/mi12111389 - 12 Nov 2021
Cited by 5 | Viewed by 1277
Abstract
The authors would like to update the Figure 3 and Figure 7 to the published paper [...] Full article
(This article belongs to the Special Issue Physical Microelectromechanical Systems (MEMS): Design, Modeling, Fabrication, and Characterization)
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