Structural Health and Condition Monitoring with Acoustic Emission and Guided Ultrasonic Waves: Sensors and Transducers
A special issue of Sensors (ISSN 1424-8220). This special issue belongs to the section "Physical Sensors".
Deadline for manuscript submissions: closed (25 June 2024) | Viewed by 4637
Special Issue Editors
Interests: ultrasonic nondestructive evaluation; elastic/mechanical properties characterization; smart sensors for Structural Health Monitoring (SHM)
Interests: experimental mechanics; ultrasonic guided waves; nondestructive evaluation; structural health monitoring; rail safety
Interests: acoustics; nondestructive evaluation (NDE); ultrasonic material characterization; advanced ultrasonic imaging; numerical modeling of elastic waves and metamaterials
Special Issues, Collections and Topics in MDPI journals
Special Issue Information
Dear Colleagues,
The Special Issue aims to highlight the recent progress and trends in sensors and transducer technologies that enable structural health and condition monitoring (SHCM) with acoustic emission (AE) and guided ultrasonic waves (GUWs). In recent years, significant development has been made in SHCM based on AE and GUWs, which is now widely utilized in various fields, including aerospace, civil engineering, transportation, etc. Sensors play a critical role in structural health monitoring systems. With the development of technologies such as advanced manufacturing, artificial intelligence, big data, 5G and the Internet of Things, sensing techniques are developing rapidly in the direction of intelligence, integration, multi-functionality and networking.
This Special Issue aims to encourage researchers to contribute their original research articles and review articles to enhance the capabilities of sensors and sensing applications. Both experimental and theoretical/simulated results are welcome.
Potential topics include, but are not limited to, the following:
- Sensor design and advanced manufacturing;
- Smart materials and novel sensing techniques;
- Sensor network design, data transmission, wired and wireless communication;
- Sensors for extreme environmental conditions;
- Instruments and instrumentation for sensing applications;
- Sensor/structure integration technology;
- Wave analysis in acoustic emission and guided ultrasonic waves.
Dr. Yan Lyu
Dr. Xuan Zhu
Dr. Fan Shi
Guest Editors
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