System-Integrated Intelligence and Intelligent Systems
A special issue of Sensors (ISSN 1424-8220).
Deadline for manuscript submissions: closed (31 January 2017) | Viewed by 124074
Special Issue Editors
2. Department Mechanical Engineering, University of Siegen, 57072 Siegen, Germany
Interests: artificial intelligence; machine learning; distributed systems; parallel systems; programming languages, self-organizing systems; multi-agent systems
Special Issues, Collections and Topics in MDPI journals
Interests: modeling and design of mechatronic systems; control of complex systems; suspension systems and vehicle dynamics control; hardware
Interests: product service systems; intelligent products; cyber physical systems; virtual enterprise; concurrent engineering
Interests: geometry and functionalizing manufacturing processes; machine tools for cutting and grinding; production planning and control; simulation of manufacturing processes
Interests: porous and cellular metals; metal foams; syntactic foams; metal matrix syntactic foams; metal matrix composites; powder metallurgy; powder technology; finite element analysis; integrated computational materials engineering (ICME); smart structures; sensor integration; sensorial materials; structural health monitoring (SHM)
Special Issues, Collections and Topics in MDPI journals
Special Issue Information
Dear Colleagues,
The Special Issue, SI3S (Short Title: System-Integrated Intelligence and Intelligent Systems), will be linked to the 3nd International Conference on System-Integrated Intelligence (SysInt 2016, see www.sysint-conference.org). On the one hand, it will gather the top contributions presented at this event, and on the other hand, is an open call for outstanding submissions.
The conference itself provided a forum for academia and industry to present their latest research findings, innovations, and practices in the field of system-integrated intelligence. It focused on the integration of advanced functional capabilities into materials, systems, parts, and products as an enabling technology for established application scenarios, as well as new products and services. The perspectives are highly interdisciplinary. The technological basis extends from new sensor technologies via material-integrated sensing and intelligence to aspects of communication and data evaluation. It includes the implementation of such approaches in autonomous decision-making, self-optimization, and control in advanced engineering products and systems.
The conference further addressed wider fields of research, such as materials science and engineering, microsystems technology, mechatronic systems, and production engineering, as well as electronics and computer science. Specific application environments in the field of robotics, structural health monitoring, production, and logistics were highlighted in the program through the definition of dedicated symposia. Studies on implementation of system-integrated intelligence in additional scenarios beyond this scope are highly welcome.
Individual topics of interest include, but are not limited to:
- Methods and Algorithms: Agent-based systems, Machine Learning and biologically-inspired methods for optimization, design, production, and planning
- Self-Optimization and Autonomous Control: Design, reliability, modeling and validation
- Sensorial Materials, material-integrated sensing and intelligence
- Advanced Applications of Autonomous Objects and Systems
- Human-Machine-Interaction: Visualization and transparency
- Gentelligent Production
- Cyber-Physical Systems in Production and Logistics
- Perceptive Robotics
- Structural Health Monitoring
- Cloud Computing and Production
Dr. Stefan Bosse
Prof. Dr. Ansgar Trächtler
Prof. Dr. Klaus-Dieter Thoben
Prof. Dr. Berend Denkena
Dr. Dirk Lehmhus
Guest Editors
Manuscript Submission Information
Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.
Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Sensors is an international peer-reviewed open access semimonthly journal published by MDPI.
Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.
Keywords
- Intelligent Systems: Enabling Technologies
- The Future of Manufacturing: Cyber-Physical Production and Logistic Systems
- Pervasive and Ubiquitous Computing
- Structural Health Monitoring
- Systems Engineering in Advanced Mechatronics
Benefits of Publishing in a Special Issue
- Ease of navigation: Grouping papers by topic helps scholars navigate broad scope journals more efficiently.
- Greater discoverability: Special Issues support the reach and impact of scientific research. Articles in Special Issues are more discoverable and cited more frequently.
- Expansion of research network: Special Issues facilitate connections among authors, fostering scientific collaborations.
- External promotion: Articles in Special Issues are often promoted through the journal's social media, increasing their visibility.
- e-Book format: Special Issues with more than 10 articles can be published as dedicated e-books, ensuring wide and rapid dissemination.
Further information on MDPI's Special Issue polices can be found here.