Huang, C.-H.; Lee, C.-H.; Hsieh, T.-M.; Tsao, L.-C.; Wu, S.; Liou, J.-C.; Wang, M.-Y.; Chen, L.-C.; Yip, M.-C.; Fang, W.
Implementation of the CMOS MEMS Condenser Microphone with Corrugated Metal Diaphragm and Silicon Back-Plate. Sensors 2011, 11, 6257-6269.
https://doi.org/10.3390/s110606257
AMA Style
Huang C-H, Lee C-H, Hsieh T-M, Tsao L-C, Wu S, Liou J-C, Wang M-Y, Chen L-C, Yip M-C, Fang W.
Implementation of the CMOS MEMS Condenser Microphone with Corrugated Metal Diaphragm and Silicon Back-Plate. Sensors. 2011; 11(6):6257-6269.
https://doi.org/10.3390/s110606257
Chicago/Turabian Style
Huang, Chien-Hsin, Chien-Hsing Lee, Tsung-Min Hsieh, Li-Chi Tsao, Shaoyi Wu, Jhyy-Cheng Liou, Ming-Yi Wang, Li-Che Chen, Ming-Chuen Yip, and Weileun Fang.
2011. "Implementation of the CMOS MEMS Condenser Microphone with Corrugated Metal Diaphragm and Silicon Back-Plate" Sensors 11, no. 6: 6257-6269.
https://doi.org/10.3390/s110606257
APA Style
Huang, C. -H., Lee, C. -H., Hsieh, T. -M., Tsao, L. -C., Wu, S., Liou, J. -C., Wang, M. -Y., Chen, L. -C., Yip, M. -C., & Fang, W.
(2011). Implementation of the CMOS MEMS Condenser Microphone with Corrugated Metal Diaphragm and Silicon Back-Plate. Sensors, 11(6), 6257-6269.
https://doi.org/10.3390/s110606257
