Wu, J.; Lei, L.; Chen, X.; Cai, X.; Li, Y.; Han, T.
A Three-Dimensional Microdisplacement Sensing System Based on MEMS Bulk-Silicon Technology. Sensors 2014, 14, 20533-20542.
https://doi.org/10.3390/s141120533
AMA Style
Wu J, Lei L, Chen X, Cai X, Li Y, Han T.
A Three-Dimensional Microdisplacement Sensing System Based on MEMS Bulk-Silicon Technology. Sensors. 2014; 14(11):20533-20542.
https://doi.org/10.3390/s141120533
Chicago/Turabian Style
Wu, Junjie, Lihua Lei, Xin Chen, Xiaoyu Cai, Yuan Li, and Tao Han.
2014. "A Three-Dimensional Microdisplacement Sensing System Based on MEMS Bulk-Silicon Technology" Sensors 14, no. 11: 20533-20542.
https://doi.org/10.3390/s141120533
APA Style
Wu, J., Lei, L., Chen, X., Cai, X., Li, Y., & Han, T.
(2014). A Three-Dimensional Microdisplacement Sensing System Based on MEMS Bulk-Silicon Technology. Sensors, 14(11), 20533-20542.
https://doi.org/10.3390/s141120533