Xie, B.; Xing, Y.; Wang, Y.; Chen, J.; Chen, D.; Wang, J.
A Lateral Differential Resonant Pressure Microsensor Based on SOI-Glass Wafer-Level Vacuum Packaging. Sensors 2015, 15, 24257-24268.
https://doi.org/10.3390/s150924257
AMA Style
Xie B, Xing Y, Wang Y, Chen J, Chen D, Wang J.
A Lateral Differential Resonant Pressure Microsensor Based on SOI-Glass Wafer-Level Vacuum Packaging. Sensors. 2015; 15(9):24257-24268.
https://doi.org/10.3390/s150924257
Chicago/Turabian Style
Xie, Bo, Yonghao Xing, Yanshuang Wang, Jian Chen, Deyong Chen, and Junbo Wang.
2015. "A Lateral Differential Resonant Pressure Microsensor Based on SOI-Glass Wafer-Level Vacuum Packaging" Sensors 15, no. 9: 24257-24268.
https://doi.org/10.3390/s150924257
APA Style
Xie, B., Xing, Y., Wang, Y., Chen, J., Chen, D., & Wang, J.
(2015). A Lateral Differential Resonant Pressure Microsensor Based on SOI-Glass Wafer-Level Vacuum Packaging. Sensors, 15(9), 24257-24268.
https://doi.org/10.3390/s150924257