Scott, R.; Vidakovic, M.; Chikermane, S.; McKinley, B.; Sun, T.; Banerji, P.; Grattan, K.
Encapsulation of Fiber Optic Sensors in 3D Printed Packages for Use in Civil Engineering Applications: A Preliminary Study. Sensors 2019, 19, 1689.
https://doi.org/10.3390/s19071689
AMA Style
Scott R, Vidakovic M, Chikermane S, McKinley B, Sun T, Banerji P, Grattan K.
Encapsulation of Fiber Optic Sensors in 3D Printed Packages for Use in Civil Engineering Applications: A Preliminary Study. Sensors. 2019; 19(7):1689.
https://doi.org/10.3390/s19071689
Chicago/Turabian Style
Scott, Richard, Miodrag Vidakovic, Sanjay Chikermane, Brett McKinley, Tong Sun, Pradipta Banerji, and Kenneth Grattan.
2019. "Encapsulation of Fiber Optic Sensors in 3D Printed Packages for Use in Civil Engineering Applications: A Preliminary Study" Sensors 19, no. 7: 1689.
https://doi.org/10.3390/s19071689
APA Style
Scott, R., Vidakovic, M., Chikermane, S., McKinley, B., Sun, T., Banerji, P., & Grattan, K.
(2019). Encapsulation of Fiber Optic Sensors in 3D Printed Packages for Use in Civil Engineering Applications: A Preliminary Study. Sensors, 19(7), 1689.
https://doi.org/10.3390/s19071689