Kuo, P.-C.; Chow, C.-W.; Lin, Y.-Z.; Gunawan, W.H.; Hung, T.-Y.; Jian, Y.-H.; Chen, G.-H.; Peng, C.-W.; Liu, Y.; Yeh, C.-H.
Design Consideration, Numerical and Experimental Analyses of Mode-Division-Multiplexed (MDM) Silicon Photonics Integrated Circuit with Sharp Bends. Sensors 2023, 23, 2965.
https://doi.org/10.3390/s23062965
AMA Style
Kuo P-C, Chow C-W, Lin Y-Z, Gunawan WH, Hung T-Y, Jian Y-H, Chen G-H, Peng C-W, Liu Y, Yeh C-H.
Design Consideration, Numerical and Experimental Analyses of Mode-Division-Multiplexed (MDM) Silicon Photonics Integrated Circuit with Sharp Bends. Sensors. 2023; 23(6):2965.
https://doi.org/10.3390/s23062965
Chicago/Turabian Style
Kuo, Pin-Cheng, Chi-Wai Chow, Yuan-Zeng Lin, Wahyu Hendra Gunawan, Tun-Yao Hung, Yin-He Jian, Guan-Hong Chen, Ching-Wei Peng, Yang Liu, and Chien-Hung Yeh.
2023. "Design Consideration, Numerical and Experimental Analyses of Mode-Division-Multiplexed (MDM) Silicon Photonics Integrated Circuit with Sharp Bends" Sensors 23, no. 6: 2965.
https://doi.org/10.3390/s23062965
APA Style
Kuo, P. -C., Chow, C. -W., Lin, Y. -Z., Gunawan, W. H., Hung, T. -Y., Jian, Y. -H., Chen, G. -H., Peng, C. -W., Liu, Y., & Yeh, C. -H.
(2023). Design Consideration, Numerical and Experimental Analyses of Mode-Division-Multiplexed (MDM) Silicon Photonics Integrated Circuit with Sharp Bends. Sensors, 23(6), 2965.
https://doi.org/10.3390/s23062965
