Article Versions Notes

Takei Y, Nomura K-i, Horii Y, Zymelka D, Ushijima H, Kobayashi T. Fabrication of Simultaneously Implementing “Wired Face-Up and Face-Down Ultrathin Piezoresistive Si Chips” on a Film Substrate by Screen-Offset Printing. Micromachines. 2019; 10(9):563. https://doi.org/10.3390/mi10090563

Takei, Yusuke, Ken-ichi Nomura, Yoshinori Horii, Daniel Zymelka, Hirobumi Ushijima, and Takeshi Kobayashi. 2019. "Fabrication of Simultaneously Implementing “Wired Face-Up and Face-Down Ultrathin Piezoresistive Si Chips” on a Film Substrate by Screen-Offset Printing" Micromachines 10, no. 9: 563. https://doi.org/10.3390/mi10090563

Takei, Y., Nomura, K. -i., Horii, Y., Zymelka, D., Ushijima, H., & Kobayashi, T. (2019). Fabrication of Simultaneously Implementing “Wired Face-Up and Face-Down Ultrathin Piezoresistive Si Chips” on a Film Substrate by Screen-Offset Printing. Micromachines, 10(9), 563. https://doi.org/10.3390/mi10090563