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Journal: Micromachines, 2021
Volume: 12
Number: 361

Article: A New Approach for the Control and Reduction of Warpage and Residual Stresses in Bonded Wafer
Authors: by Seyed Amir Fouad Farshchi Yazdi, Matteo Garavaglia, Aldo Ghisi and Alberto Corigliano
Link: https://www.mdpi.com/2072-666X/12/4/361

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