Goldstein, Y.; Spitz, S.; Turjeman, K.; Selinger, F.; Barenholz, Y.; Ertl, P.; Benny, O.; Bavli, D.
Breaking the Third Wall: Implementing 3D-Printing Techniques to Expand the Complexity and Abilities of Multi-Organ-on-a-Chip Devices. Micromachines 2021, 12, 627.
https://doi.org/10.3390/mi12060627
AMA Style
Goldstein Y, Spitz S, Turjeman K, Selinger F, Barenholz Y, Ertl P, Benny O, Bavli D.
Breaking the Third Wall: Implementing 3D-Printing Techniques to Expand the Complexity and Abilities of Multi-Organ-on-a-Chip Devices. Micromachines. 2021; 12(6):627.
https://doi.org/10.3390/mi12060627
Chicago/Turabian Style
Goldstein, Yoel, Sarah Spitz, Keren Turjeman, Florian Selinger, Yechezkel Barenholz, Peter Ertl, Ofra Benny, and Danny Bavli.
2021. "Breaking the Third Wall: Implementing 3D-Printing Techniques to Expand the Complexity and Abilities of Multi-Organ-on-a-Chip Devices" Micromachines 12, no. 6: 627.
https://doi.org/10.3390/mi12060627
APA Style
Goldstein, Y., Spitz, S., Turjeman, K., Selinger, F., Barenholz, Y., Ertl, P., Benny, O., & Bavli, D.
(2021). Breaking the Third Wall: Implementing 3D-Printing Techniques to Expand the Complexity and Abilities of Multi-Organ-on-a-Chip Devices. Micromachines, 12(6), 627.
https://doi.org/10.3390/mi12060627