Li, M.; Guo, Y.; Yao, J.; Zhang, J.; Liu, F.; Tang, W.
Extraction of Interface-Trap Densities of the Stacked Bonding Structure in 3D Integration Using High-Frequency Capacitance-Voltage Technique. Micromachines 2022, 13, 262.
https://doi.org/10.3390/mi13020262
AMA Style
Li M, Guo Y, Yao J, Zhang J, Liu F, Tang W.
Extraction of Interface-Trap Densities of the Stacked Bonding Structure in 3D Integration Using High-Frequency Capacitance-Voltage Technique. Micromachines. 2022; 13(2):262.
https://doi.org/10.3390/mi13020262
Chicago/Turabian Style
Li, Man, Yufeng Guo, Jiafei Yao, Jun Zhang, Fanyu Liu, and Weihua Tang.
2022. "Extraction of Interface-Trap Densities of the Stacked Bonding Structure in 3D Integration Using High-Frequency Capacitance-Voltage Technique" Micromachines 13, no. 2: 262.
https://doi.org/10.3390/mi13020262
APA Style
Li, M., Guo, Y., Yao, J., Zhang, J., Liu, F., & Tang, W.
(2022). Extraction of Interface-Trap Densities of the Stacked Bonding Structure in 3D Integration Using High-Frequency Capacitance-Voltage Technique. Micromachines, 13(2), 262.
https://doi.org/10.3390/mi13020262