Article Versions Notes

Saleh R, Schütt S, Barth M, Lang T, Eberhardt W, Zimmermann A. Assembly of Surface-Mounted Devices on Flexible Substrates by Isotropic Conductive Adhesive and Solder and Lifetime Characterization. Micromachines. 2022; 13(8):1240. https://doi.org/10.3390/mi13081240

Saleh, Rafat, Sophie Schütt, Maximilian Barth, Thassilo Lang, Wolfgang Eberhardt, and André Zimmermann. 2022. "Assembly of Surface-Mounted Devices on Flexible Substrates by Isotropic Conductive Adhesive and Solder and Lifetime Characterization" Micromachines 13, no. 8: 1240. https://doi.org/10.3390/mi13081240

Saleh, R., Schütt, S., Barth, M., Lang, T., Eberhardt, W., & Zimmermann, A. (2022). Assembly of Surface-Mounted Devices on Flexible Substrates by Isotropic Conductive Adhesive and Solder and Lifetime Characterization. Micromachines, 13(8), 1240. https://doi.org/10.3390/mi13081240